Prevention of contamination of substrates during pressure changes in processing systems

TW202641254APending Publication Date: 2026-10-01APPLIED MATERIALS INC
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Patent Information

Application Number
TW115121067
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-08-12
Filing Date
2022-08-15
Publication Date
2026-10-01

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Abstract

Disclosed are implementations for minimizing substrate contamination during pressure changes in substrate processing systems. Over a duration of a pressure change (increase or decrease) in a chamber of a substrate processing system, a flow rate is adjusted multiple times to reduce occurrence of contaminant particles in an environment of the chamber. In some instances, the flow rate is changed continuously using at least one dynamic valve that enable continuous control over the pressure dynamics of the chamber.
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