Wafer placement table

Abstract

The wafer mounting stage 10 includes: a ceramic plate 20 with at least a wafer mounting portion 22 on its top surface; a cooling plate 30 bonded to the bottom surface of the ceramic plate 20 and having a refrigerant flow path 32; gas common paths 51b, 52b, and 53b disposed above the refrigerant flow path 32; gas inlet paths 51a, 52a, and 53a respectively extending from the bottom surface of the cooling plate 30 to the gas common paths 51b, 52b, and 53b; and a plurality of gas distribution paths 51e, 52e, and 53e respectively disposed for the gas common paths 51b, 52b, and 53b. The gas distribution path 53e disposed on the outermost periphery of the ceramic plate 20 is positioned so as not to overlap with the refrigerant flow path 32 when viewed from above. A wafer placement table 10 includes a ceramic plate 20 that has at least a wafer placement part 22 at an upper surface thereof, a cooling plate 30 that is joined to a lower surface of the ceramic plate 20 and that has a refrigerant flow path 32, gas common paths 51b, 52b, and 53b that are provided above the refrigerant flow path 32, gas introduction paths 51a, 52a, 53a that extend from a lower surface of the cooling plate 30 to a corresponding one of the gas common paths 51b, 52b, 53b, and a plurality of gas distribution paths 51e, 52e, and 53e that are provided for the gas common paths 51b, 52b, and 53b. The gas distribution path 53e that is disposed at an outermost periphery of the ceramic plate 20 is provided at a position that does not overlap the refrigerant flow path 32 in plan view.

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