Substrate processing apparatus, side box, substrate processing method, semiconductor device manufacturing method and program product

Abstract

This application provides a substrate processing apparatus capable of suppressing the increase in component dimensions. The substrate processing apparatus includes: a first processing module having a first processing container; a second processing module having a second processing container and disposed adjacent to the side of the first processing module; a first common facility disposed adjacent to the back of the first processing module, including a first supply system for supplying processing gas into the first processing container; and a second common facility disposed adjacent to the back of the second processing module. The first and second processing modules have first and second outer side surfaces parallel to the front-rear direction on opposite sides of their adjacent surfaces, respectively. The first common facility protrudes further outward than the first outer side surface and has a first side box for housing a portion of the first supply system. The portion of the first supply system housed in the first side box is configured to be maintained by access from at least one of the front, rear, and top of the first side box, independent of access from the side of the first side box.

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