Element transfer system and element transfer method

Abstract

An element transfer system includes a pedestal, one or multiple first transfer stamps and a first thermal compression head. The pedestal is located in a thermal compression bonding stage and is used for carrying a backplane. The one or multiple first transfer stamps are located in a first waiting stage on a first side of the thermal compression bonding stage, and are cooled in the first waiting stage. The first thermal compression head is used to attract one of the one or multiple first transfer stamps in the first waiting stage, and heat and press the one of the one or multiple first transfer stamps in the thermal compression bonding stage to transfer multiple first elements to the backplane.

Description

[Technical Field]

[0001] This invention relates to a component transposition system and a component transposition method. [Previous Technology]

[0002] In the manufacturing process of electronic products, there are often related electronic component transfer steps. For example, in the manufacturing process of micro light-emitting diode (micro LED) display devices, the micro light-emitting diode is often transferred from a temporary substrate to a backplane with driving circuitry by a component transfer system, and the micro light-emitting diode is connected to the pads of the aforementioned driving circuitry by thermo-pressing.

[0003] However, transferring and hot-pressing all the micro LEDs onto the backplate requires multiple transfer and hot-pressing steps. The prolonged high temperature can cause the backplate and the transpose stamp used to perform the transfer and hot-pressing steps to overheat, making it easy for the micro LEDs and the pads to fall off due to unstable connection caused by overheating, resulting in a decrease in product reliability and yield. [Summary of the Invention]

[0004] The present invention provides a component transposition system and a component transposition method, which can reduce the overheating of the backplate and / or transposition stamp, thereby improving the reliability and yield of the product.

[0005] The component transfer system proposed in at least one embodiment of the present invention includes a stage, one or more first transfer stamps, and a first hot press head. The stage is located in the hot press bonding area and is used to support a back plate. One or more first transfer stamps are located in a first waiting area on a first side of the hot press bonding area and are cooled in the first waiting area. The first hot press head is used to pick up one of the one or more first transfer stamps in the first waiting area, and to heat and press one of the one or more first transfer stamps in the hot press bonding area to transfer a plurality of first components onto the back plate.

[0006] In at least one embodiment of the present invention, the component transposition system further includes a first transport turntable, the first waiting area having a first cooling area, a first air cooling area and a first preparation area, the first transport turntable being used to transport the one or more first transposition stamps sequentially to the first cooling area for cooling, to the first air cooling area for cooling and to the first preparation area to wait to be picked up by the first hot press head.

[0007] In at least one embodiment of the present invention, the first hot press head picks up the plurality of first elements in a first pick-up area located between the first waiting area and the hot press bonding area by means of one of the one or more first transpose stamps.

[0008] In at least one embodiment of the present invention, the component transposition system further includes one or more second transposition stamps and a second hot press head. One or more second transposition stamps are located in a second waiting area on a second side of the hot press bonding area relative to the first side and are cooled in the second waiting area. The second hot press head is used to pick up one of the one or more second transposition stamps in the second waiting area, and to heat and press one of the aforementioned second transposition stamps in the hot press bonding area to transfer a plurality of second components onto the backplate.

[0009] In at least one embodiment of the present invention, the component transfer system further includes a second transport turntable, the second waiting area having a second cooling area, a second air-cooling area and a second preparation area, the second transport turntable being used to transport the one or more second transfer stamps sequentially to the second cooling area for cooling, to the second air-cooling area for cooling and to the second preparation area to wait to be picked up by the second hot press head.

[0010] In at least one embodiment of the present invention, the second hot press head picks up the plurality of second elements in a second pick-up area located between the second waiting area and the hot press bonding area by means of one of the one or more second transpose stamps.

[0011] In at least one embodiment of the present invention, the stage has a high temperature zone and one or more low temperature zones adjacent to the high temperature zone, and the temperature of the high temperature zone is higher than the temperature of one or more low temperature zones. On the normal of the stage, a portion of the back plate overlaps with the high temperature zone, and other portions of the back plate overlap with one or more low temperature zones.

[0012] In at least one embodiment of the present invention, the stage further has a depletion region located between the high temperature region and the one or more low temperature regions, the depletion region being an air gap or a solid gap formed by a heat-insulating material.

[0013] The component transfer system proposed in at least another embodiment of the present invention includes a stage, a first hot press head, a first transfer stamp, and a first air cooling device. The stage is located in the hot press bonding area and is used to support a back plate. The first transfer stamp is disposed on the first hot press head, which picks up a plurality of first components in a first pick-up area located on a first side of the hot press bonding area using the first transfer stamp, and heats and pressurizes the first transfer stamp in the hot press bonding area to transfer these first components onto the back plate. The first air cooling device is used to provide gas to cool the first transfer stamp.

[0014] In at least another embodiment of the present invention, the component transposition system further includes a second hot press head, a second transposition stamp, and a second air-cooling device. The second transposition stamp is disposed on the second hot press head, which picks up a plurality of second components in a second pick-up area located on a second side of the hot-press bonding area relative to the first side using the second transposition stamp. The second hot press head heats and pressurizes the second transposition stamp in the hot-press bonding area to transfer these second components onto the back plate. The second air-cooling device provides gas to cool the second transposition stamp.

[0015] In at least another embodiment of the present invention, the stage has a high temperature zone and one or more low temperature zones adjacent to the high temperature zone, and the temperature of the high temperature zone is higher than the temperature of one or more low temperature zones. On the normal of the stage, a portion of the back plate overlaps with the high temperature zone, and other portions of the back plate overlap with one or more low temperature zones.

[0016] In at least another embodiment of the present invention, the stage further has a depletion region located between the high temperature region and the one or more low temperature regions, the depletion region being an air gap or a solid gap formed by a heat-insulating material.

[0017] The component transfer system proposed in at least one embodiment of the present invention includes a stage, a hot press head, and a transfer stamp. The stage is used to support a backplate and has a high-temperature zone and one or more low-temperature zones adjacent to the high-temperature zone, wherein the temperature of the high-temperature zone is higher than the temperature of the one or more low-temperature zones. The transfer stamp is disposed on the hot press head, which heats and pressurizes the transfer stamp in the high-temperature zone to transfer multiple components onto the backplate.

[0018] In at least one more embodiment of the present invention, on the normal of the stage, a portion of the back plate overlaps with the high-temperature zone, and other portions of the back plate overlap with one or more low-temperature zones.

[0019] In at least one more embodiment of the present invention, the stage further has a depletion region located between the high temperature region and the one or more low temperature regions, the depletion region being an air gap or a solid gap formed by a heat-insulating material.

[0020] The component transposition method proposed in at least another embodiment of the present invention includes the following steps: A stage is provided, the stage being located in a thermocompression bonding area. A backplate is disposed on the stage. One or more first transposition stamps are provided, the one or more first transposition stamps being cooled in a first waiting area on a first side of the thermocompression bonding area. A first thermocompression head is provided, which picks up one of the one or more first transposition stamps in the first waiting area. After the first thermocompression head picks up one of the one or more first transposition stamps in the first waiting area, the first thermocompression head heats and pressurizes one of the one or more first transposition stamps in the thermocompression bonding area to transfer a plurality of first components onto the backplate.

[0021] In at least another embodiment of the present invention, the component transposition method further includes the following steps: A first transport turntable is provided, the first waiting area having a first cooling zone, a first air-cooling zone and a first preparation zone, the first transport turntable transporting the one or more first transposition stamps sequentially to the first cooling zone for cooling, to the first air-cooling zone for cooling, and to the first preparation zone for waiting to be picked up by the first hot press head.

[0022] In at least another embodiment of the present invention, the component transposition method further includes the following steps. Before transferring the plurality of first components onto the backplate, the first hot press head picks up the plurality of first components in a first pick-up area located between the first waiting area and the hot press bonding area by means of one of the one or more first transposition stamps.

[0023] In at least another embodiment of the present invention, the component transposition method further includes the following steps: Providing one or more second transposition stamps, the one or more second transposition stamps being cooled in a second waiting area on a second side of the thermocompression bonding region relative to the first side. Providing a second thermocompression head, while the first thermocompression head heats and presses one of the one or more first transposition stamps in the thermocompression bonding region to transfer the plurality of first components onto the backplate, the second thermocompression head picking up one of the one or more second transposition stamps in the second waiting area. After the first thermocompression head heats and presses one of the one or more first transposition stamps in the thermocompression bonding region to transfer the plurality of first components onto the backplate, removing one of the one or more first transposition stamps from the first thermocompression head in the first waiting area. After the second hot press head picks up one or more of the aforementioned second transpose stamps in the second waiting area, and removes one or more of the aforementioned first transpose stamps from the first hot press head in the first waiting area, the second hot press head heats and presses one or more of the aforementioned second transpose stamps in the hot press bonding area to transfer a plurality of second elements onto the back plate.

[0024] In at least another embodiment of the present invention, the component transposition method further includes the following steps: A second transport turntable is provided, the second waiting area having a second cooling zone, a second air-cooling zone and a second preparation zone, the second transport turntable transporting the one or more second transposition stamps sequentially to the second cooling zone for cooling, to the second air-cooling zone for cooling, and to the second preparation zone for waiting to be picked up by the second hot press head.

[0025] In at least another embodiment of the present invention, the component transposition method further includes the following steps. Before transferring the plurality of second components onto the backplate, the second hot press head picks up the plurality of second components in a second pick-up area located between the second waiting area and the hot press bonding area by means of one of the one or more second transposition stamps.

[0026] In at least another embodiment of the present invention, the stage has a high temperature zone and one or more low temperature zones adjacent to the high temperature zone, and the temperature of the high temperature zone is higher than the temperature of one or more low temperature zones. On the normal of the stage, a first portion of the back plate overlaps with the high temperature zone, and a second portion of the back plate overlaps with one or more low temperature zones.

[0027] In at least another embodiment of the present invention, the stage further has a depletion region located between the high temperature region and the one or more low temperature regions, the depletion region being an air gap or a solid gap formed by a heat-insulating material.

[0028] The component transfer method proposed in at least one embodiment of the present invention includes the following steps: A stage is provided, the stage being located in a thermo-pressing bonding area. A backplate is disposed on the stage. A first thermo-pressing head and a first transfer stamp disposed on the first thermo-pressing head are provided. The first thermo-pressing head picks up a plurality of first components in a first pick-up area located on a first side of the thermo-pressing bonding area using the first transfer stamp, and heats and pressurizes the first transfer stamp in the thermo-pressing bonding area to transfer these first components onto the backplate. A first air-cooling device is provided. After the first thermo-pressing head heats and pressurizes the first transfer stamp in the thermo-pressing bonding area to transfer these first components onto the backplate, the first air-cooling device provides gas to cool the first transfer stamp.

[0029] In at least one further embodiment of the present invention, the component transposition method further includes the following steps: A second hot press head and a second transposition stamp disposed on the second hot press head are provided. The second hot press head picks up a plurality of second components in a second pick-up area on a second side of the hot press bonding area relative to the first side using the second transposition stamp. While the first air-cooling device provides gas to cool the first transposition stamp, the second hot press head heats and pressurizes the second transposition stamp in the hot press bonding area to transfer these second components onto the back plate. A second air-cooling device is provided, and after the second hot press head heats and pressurizes the second transposition stamp in the hot press bonding area to transfer these second components onto the back plate, the second air-cooling device provides gas to cool the second transposition stamp.

[0030] In at least one more embodiment of the present invention, the stage has a high temperature zone and one or more low temperature zones adjacent to the high temperature zone, and the temperature of the high temperature zone is higher than the temperature of one or more low temperature zones. On the normal of the stage, a first portion of the back plate overlaps with the high temperature zone, and a second portion of the back plate overlaps with one or more low temperature zones.

[0031] In at least one more embodiment of the present invention, the stage further has a depletion region located between the high temperature region and the one or more low temperature regions, the depletion region being an air gap or a solid gap formed by a heat-insulating material.

[0032] The component transposition method proposed in at least another embodiment of the present invention includes the following steps: A stage is provided, the stage having a high-temperature region and one or more low-temperature regions adjacent to the high-temperature region, wherein the temperature of the high-temperature region is higher than the temperature of the one or more low-temperature regions. A back plate is disposed on the stage, a first portion of the back plate overlapping the high-temperature region on the normal of the stage, and a second portion of the back plate overlapping the one or more low-temperature regions on the normal of the stage. A hot press head and a transposition stamp disposed on the hot press head are provided. After the first portion of the back plate overlaps the high-temperature region on the normal of the stage, the hot press head heats and presses the transposition stamp to transfer a plurality of first components onto the first portion of the back plate. After the hot press head heats and presses the transposition stamp to transfer these first components onto the first portion of the back plate, the back plate is moved such that the first portion of the back plate overlaps the one or more low-temperature regions on the normal of the stage, while the second portion of the back plate overlaps the high-temperature region on the normal of the stage. After the second part of the backplate overlaps with the high-temperature zone on the normal of the stage, the hot press head heats and pressurizes the transfer stamp to transfer multiple second elements onto the second part of the backplate.

[0033] In at least another embodiment of the present invention, the stage further has a depletion region located between the high temperature region and the one or more low temperature regions, the depletion region being an air gap or a solid gap formed by a heat-insulating material.

Implementation Method

[0034] In the following text, in order to clearly present the technical features of the present invention, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions) in the drawings will be enlarged proportionally, and the number of some elements will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings and the size and shape of the elements, but should cover the size, shape, and deviations of both caused by actual manufacturing processes and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the drawings of the present invention are mainly for illustration and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the scope of the claims of the present invention.

[0035] Secondly, the terms "about," "approximately," or "substantially" used in this invention not only cover explicitly stated numerical values ​​and ranges, but also cover the permissible deviation range that can be understood by someone skilled in the art to which this invention pertains. This deviation range can be determined by errors that occur during measurement, such as those caused by limitations of the measurement system or process conditions. Furthermore, "about" can mean within one or more standard deviations of the aforementioned numerical values, for example, ±30%, ±20%, ±10%, or ±5%.

[0036] The spatial relative terms used in this invention, such as "below," "under," "above," and "above," are for the convenience of describing the relative relationship between one element or feature and another element or feature, as illustrated in the figures. The true meaning of these spatial relative terms includes other orientations. For example, when the illustration is rotated 180 degrees vertically, the relationship between one element and another may change from "below" or "under" to "above" or "above." Furthermore, the spatial relative descriptions used in this invention should also be interpreted in the same way.

[0037] It should be understood that although the present invention may use terms such as "first," "second," and "third" to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one signal from another. In addition, the term "or" as used in the present invention may, as appropriate, include any combination of one or more of the associated listed items.

[0038] Although the present invention uses a series of operations or steps to illustrate the repair method, the order in which these operations or steps are shown should not be construed as a limitation of the invention. For example, some operations or steps may be performed in a different order and / or simultaneously with other steps. Furthermore, each operation or step described herein may comprise several sub-steps or actions.

[0039] Furthermore, the present invention can be implemented or applied through other different specific embodiments, and the details of the present invention can also be combined, modified and changed in various embodiments based on different viewpoints and applications without departing from the concept of the present invention.

[0040] FIG1 is a schematic diagram of a component transfer system 10 according to at least one embodiment of the present invention. Referring to FIG1, the component transfer system 10 includes a stage 100, one or more first transfer stamps 200, and a first hot press head 300. The stage 100 is located in the hot press bonding area BS and is used to support the back plate 102. One or more first transfer stamps 200 are located in a first waiting area WS1 on a first side of the hot press bonding area BS (e.g., the left side of the hot press bonding area BS in FIG1) and are cooled in the first waiting area WS1. The first hot press head 300 is used to pick up one of the one or more first transfer stamps 200 in the first waiting area WS1 and heat and pressurize one of the one or more first transfer stamps 200 in the hot press bonding area BS to transfer a plurality of first components 400 onto the back plate 102.

[0041] By cooling the first transpose stamp 200 in the first waiting area WS1, the same transpose stamp can be prevented from overheating due to prolonged high temperature. Therefore, the situation where the first component 400 and the back plate 102 cannot be stably connected due to overheating can be reduced, thereby improving the reliability and yield of the product.

[0042] Figure 2 is a schematic diagram of a transport turntable according to at least one embodiment of the present invention. Referring to Figures 1 and 2, the component transfer system 10 further includes a first transport turntable 800, and a first waiting area WS1 having a first cooling area TS1, a first air-cooling area CS1 and a first preparation area RS1. The first transport turntable 800 is used to transport one or more first transfer stamps 200 sequentially to the first cooling area TS1 for cooling, to the first air-cooling area CS1 for cooling, and to the first preparation area RS1 to wait to be picked up by the first hot press head 300.

[0043] In some embodiments, the first waiting area WS1 further includes a first unloading area US1, and the first transposed stamp 200 is removed from the first hot press head 300 in the first unloading area US1 and placed on the first carrier 802. The first transport turntable 800 can transport the first transposed stamp 200 from the first unloading area US1 sequentially to the first cooling area TS1 for cooling, to the first air-cooling area CS1 for cooling, and to the first preparation area RS1 to wait to be picked up by the first hot press head 300.

[0044] Furthermore, the first removal zone US1, the first cooling zone TS1, the first air-cooling zone CS1, and the first preparation zone RS1 can simultaneously have one or more first transfer stamps 200 removed from the first hot press head 300, undergoing cooling, being cooled, and waiting to be picked up by the first hot press head 300. Through the aforementioned design, it can be ensured that after one first transfer stamp 200 is removed from the first hot press head 300, another first transfer stamp 200 can immediately be picked up by the first hot press head 300, thereby improving process efficiency.

[0045] As shown in FIG1, the first hot press head 300 picks up the first components 400 in the first pick-up area PS1 located between the first waiting area WS1 and the hot press bonding area BS using one or more of the aforementioned first transfer stamps 200. In detail, after the first hot press head 300 moves along the Z-axis to pick up the first transfer stamp 200 in the first preparation area RS1 of the first waiting area WS1, it then moves along the X-axis to the first pick-up area PS1 to pick up the first components 400 located on the first temporary substrate 402 using the aforementioned first transfer stamp 200, and then moves along the X-axis to the hot press bonding area BS to heat and pressurize the aforementioned first transfer stamp 200 to transfer the first components 400 onto the back plate 102.

[0046] Referring again to FIG1, the component transfer system 10 further includes one or more second transfer stamps 500 and a second hot press head 600. One or more second transfer stamps 500 are located in a second waiting area WS2 on the second side of the hot press bonding area BS relative to the first side (e.g., the right side of the hot press bonding area BS in FIG1), and the one or more second transfer stamps 500 are cooled in the second waiting area WS2. The second hot press head 600 is used to pick up one of the one or more second transfer stamps 500 in the second waiting area WS2, and to heat and pressurize one of the aforementioned one of the one or more second transfer stamps 500 in the hot press bonding area BS to transfer a plurality of second components 700 onto the back plate 102.

[0047] Please refer to Figures 1 and 2. The component transfer system 10 further includes a second transport turntable 900. The second waiting area WS2 has a second cooling area TS2, a second air-cooling area CS2 and a second preparation area RS2. The second transport turntable 900 is used to transport one or more second transfer stamps 500 sequentially to the second cooling area TS2 for cooling, to the second air-cooling area CS2 for cooling, and to the second preparation area RS2 to wait to be picked up by the second hot press head 600.

[0048] In some embodiments, the second waiting area WS2 further includes a second unloading area US2, and the second transposed stamp 500 is removed from the second hot press head 600 and placed on the second carrier 902 in the second unloading area US2. The second transport turntable 900 can transport the second transposed stamp 500 from the second unloading area US2 sequentially to the second cooling area TS2 for cooling, to the second air-cooling area CS2 for cooling, and to the second preparation area RS2 to wait to be picked up by the second hot press head 600.

[0049] Furthermore, the second removal zone US2, the second cooling zone TS2, the second air-cooling zone CS2, and the second preparation zone RS2 can simultaneously have one or more second transfer stamps 500 removed from the second hot press head 600, undergoing cooling, being cooled, and waiting to be picked up by the second hot press head 600. Through the aforementioned design, it can be ensured that after the second transfer stamp 500 is removed from the second hot press head 600, another second transfer stamp 500 can immediately be picked up by the second hot press head 600, thereby improving process efficiency.

[0050] As shown in FIG1, the second hot press head 600 picks up the second elements 700 in the second pick-up area PS2 located between the second waiting area WS2 and the hot press bonding area BS using one or more of the aforementioned second transfer stamps 500. In detail, after the second hot press head 600 moves along the Z-axis to pick up the second transfer stamp 500 in the second preparation area RS2 of the second waiting area WS2, it then moves along the X-axis to the second pick-up area PS2 to pick up the second elements 700 located on the second temporary substrate 702 using the aforementioned second transfer stamp 500, and then moves along the X-axis to the hot press bonding area BS to heat and pressurize the aforementioned second transfer stamp 500 to transfer the second elements 700 onto the back plate 102.

[0051] With the above design, when the first hot press head 300 removes the first transpose stamp 200 and picks up the next first transpose stamp 200 in the first waiting area WS1, the second hot press head 600 can heat and press the second transpose stamp 500 in the hot press bonding area BS to transfer these second components 700 onto the back plate 102, and vice versa, thereby improving process efficiency.

[0052] FIG3 is a top view of a stage 100 according to at least one embodiment of the present invention. The stage 100 has a high temperature zone 110 and one or more low temperature zones 120 adjacent to the high temperature zone 110, and the temperature of the high temperature zone 110 is higher than the temperature of the one or more low temperature zones 120. On the normal of the stage 100 (e.g., the Z-axis in FIG1), a portion of the back plate 102 overlaps with the high temperature zone 110, and other portions of the back plate 102 overlap with the one or more low temperature zones 120.

[0053] Through the above design, the part of the back plate 102 that is currently being hot-pressed can be heated, while other parts of the back plate 102 that have not yet been hot-pressed or have been hot-pressed can be left unheated, thus avoiding the situation where the back plate 102 as a whole overheats due to prolonged high temperature. Therefore, the situation where the first element 400 and / or the second element 700 fail to connect stably with the back plate 102 due to overheating can be reduced, thereby improving the reliability and yield of the product.

[0054] In some embodiments, the temperature of the high-temperature zone 110 is not less than approximately 25 degrees Celsius, while the temperature of the low-temperature zone 120 is not greater than approximately 400 degrees Celsius. One or more low-temperature zones 120 may surround the high-temperature zone 110. Furthermore, as shown in FIG3, the stage 100 further has a depletion zone 130 located between the high-temperature zone 110 and one or more low-temperature zones 120. The depletion zone 130 is an air gap or a solid gap formed by a heat-insulating material. By providing the depletion zone 130, the high-temperature zone 110 and the low-temperature zone 120 can be effectively isolated, thereby allowing the high-temperature zone 110 and the low-temperature zone 120 to maintain the required temperature.

[0055] In some embodiments, the first element 400 and the second element 700 may be light-emitting diodes, such as micro light-emitting diodes, with a size of approximately 1 to 100 micrometers. For example, the first element 400 and the second element 700 may be flip-chip micro LEDs, meaning that the first electrode and the second electrode of the first element 400 and the second element 700 are both located on the side of the first element 400 and the second element 700 facing the backplate 102, but the present invention is not limited thereto. The backplate 102 may include components or lines required by the display device, such as pads, driving elements, switching elements, power lines, driving signal lines, timing signal lines, current compensation lines, detection signal lines, etc.

[0056] Figures 4A to 4H are partial schematic diagrams of the component transposition method of at least one embodiment of the present invention at different steps. Please refer to Figures 1, 4A and 4B. As shown in Figures 1 and 4A, one or more first transposition stamps 200, 200' are provided, and one or more first transposition stamps 200, 200' are located on the first side of the hot-press bonding area BS (e.g., the left side of the hot-press bonding area BS in Figure 1) in a first waiting area WS1 for cooling. As shown in Figure 4B, a first hot-press head 300 is provided to pick up one of the one or more first transposition stamps 200, 200' (e.g., the first transposition stamp 200 in Figure 4B) in the first waiting area WS1.

[0057] Please refer to Figures 1, 4C to 4G. As shown in Figures 1, 4C and 4D, a first hot press head 300 picks up a plurality of first elements 400 located on a first temporary substrate 402 in a first pick-up area PS1 located between a first waiting area WS1 and a hot press bonding area BS using one or more first transfer stamps 200, 200'. As shown in Figures 1, 4E to 4G, a stage 100 is provided, located in the hot press bonding area BS. A back plate 102 is disposed on the stage 100. The first hot press head 300 heats and presses one or more of the first transfer stamps 200, 200' in the hot press bonding area BS to transfer these first elements 400 onto the back plate 102. In some embodiments, these first elements 400 are transferred onto the back plate 102 to electrically connect to pads (not labeled) on the back plate 102.

[0058] Referring to Figures 4H to 4J, after the first hot press head 300 heats and presses one or more of the first transpose stamps 200, 200' in the hot press bonding area BS to transfer these first elements 400 onto the back plate 102, one or more of the first transpose stamps 200, 200' is removed from the first hot press head 300 in the first waiting area WS1. Then, the first hot press head 300 picks up another of the one or more first transpose stamps 200, 200' (e.g., the first transpose stamp 200' in Figure 4J) in the first waiting area WS1.

[0059] In addition, the above-described component transposition method may further include the following steps. Please continue to refer to Figures 1, 4A and 4B. As shown in Figures 1 and 4A, one or more second transposition stamps 500, 500' are provided, and one or more second transposition stamps 500, 500' are located in the second waiting area WS2 of the hot-pressed bonding area BS relative to the first side (e.g., the right side of the hot-pressed bonding area BS in Figure 1) for cooling.

[0060] As shown in FIG4B, a second hot press head 600 is provided. When the first hot press head 300 heats and presses one or more of the first transpose stamps 200, 200' in the hot press bonding area BS to transfer these first elements 400 onto the back plate 102 (i.e., the steps in FIG4E to FIG4G), one or more second transpose stamps 500, 500' (e.g., the second transpose stamp 500 in FIG4B) is picked up in the second waiting area WS2.

[0061] Please continue to refer to Figures 1, 4C to 4G. As shown in Figures 1, 4C and 4D, the second hot press head 600 picks up a plurality of second elements 700 located on the second temporary substrate 702 in the second pick-up area PS2 located between the second waiting area WS2 and the hot press bonding area BS by means of one or more of the above-mentioned second transpose stamps 500, 500'.

[0062] As shown in Figures 1, 4E to 4G, after the second hot press head 600 picks up one or more of the aforementioned second transpose stamps 500, 500' in the second waiting area WS2, and removes one or more of the aforementioned first transpose stamps 200, 200' from the first hot press head 300 in the first waiting area WS1 (i.e., the steps in Figures 4H to 4J), the second hot press head 600 heats and presses one or more of the aforementioned second transpose stamps 500, 500' in the hot press bonding area BS to transfer these second elements 700 onto the back plate 102.

[0063] Referring to Figures 4H to 4J, after the second hot press head 600 heats and presses one or more of the aforementioned second transpose stamps 500, 500' in the hot press bonding area BS to transfer these second elements 700 onto the back plate 102, one or more of the aforementioned second transpose stamps 500, 500' is removed from the second hot press head 600 in the second waiting area WS2. Then, the second hot press head 600 picks up another of the one or more second transpose stamps 500, 500' (e.g., the second transpose stamp 500' in Figure 4J) in the second waiting area WS2.

[0064] In some embodiments, the above-described component transposition method may further include providing a first transport turntable 800 and / or a second transport turntable 900 as shown in FIG2, and the implementation content is substantially the same as the relevant description in FIG2, so the same technical features will not be repeated here. In addition, the platform 100 provided by the above-described component transposition method may be the embodiment shown in FIG3, so the same technical features will not be repeated here.

[0065] Figures 5 and 6 are partial schematic diagrams of the component transposition system 10A and component transposition method of at least another embodiment of the present invention at different steps. In detail, Figures 5(A) and 6(A) are top views of the stage 100 and the back plate 102 at different steps, respectively, while Figures 5(B) and 6(B) are cross-sectional views of the hot press head 300A and the transposition stamp 200A along line a-a' in Figures 5(A) and 6(A), respectively.

[0066] Referring to Figure 5, the component transfer system 10A includes a stage 100, a hot press head 300A, and a transfer stamp 200A. The stage 100 is used to support the backplate 102. The stage 100 has a high-temperature zone 110 and one or more low-temperature zones 120 adjacent to the high-temperature zone 110, and the temperature of the high-temperature zone 110 is higher than the temperature of the one or more low-temperature zones 120. The transfer stamp 200A is disposed on the hot press head 300A. The hot press head 300A heats and pressurizes the transfer stamp 200A in the high-temperature zone 110 to transfer multiple components (not shown) onto the backplate 102.

[0067] By means of the above design, the part of the backplate 102 that is currently being hot-pressed can be heated, while other parts of the backplate 102 that have not yet been hot-pressed or have been hot-pressed can be left unheated, thus avoiding the situation where the backplate 102 as a whole overheats due to prolonged high temperature. Therefore, the situation where the components and the backplate 102 fail to connect stably due to overheating can be reduced, thereby improving the reliability and yield of the product.

[0068] In some embodiments, the temperature of the high-temperature zone 110 is approximately not less than 25 degrees Celsius, while the temperature of the low-temperature zone 120 is approximately not greater than 400 degrees Celsius. One or more low-temperature zones 120 may surround the high-temperature zone 110. Furthermore, as shown in FIG5, the stage 100 further has a depletion zone 130 located between the high-temperature zone 110 and one or more low-temperature zones 120. The depletion zone 130 is an air gap or a solid gap formed by a heat-insulating material. By providing the depletion zone 130, the high-temperature zone 110 and the low-temperature zone 120 can be effectively isolated, thereby allowing the high-temperature zone 110 and the low-temperature zone 120 to maintain the required temperature.

[0069] The above-mentioned component transposition method includes the following steps, as shown in FIG5: a stage 100 is provided, the stage 100 having a high-temperature region 110 and one or more low-temperature regions 120 adjacent to the high-temperature region 110, and the temperature of the high-temperature region 110 is higher than the temperature of the one or more low-temperature regions 120. A back plate 102 is disposed on the stage 100, a first portion (unlabeled) of the back plate 102 overlaps with the high-temperature region 110 on the normal line of the stage 100, and a second portion (unlabeled) of the back plate 102 overlaps with the one or more low-temperature regions 120 on the normal line of the stage 100. A hot press head 300A and a transfer stamp 200A disposed on the hot press head 300A are provided. After the first part of the back plate 102 overlaps with the high temperature zone 110 on the normal line of the stage 100, the hot press head 300A heats and pressurizes the transfer stamp 200A to transfer a plurality of first elements (not shown) onto the first part of the back plate 102.

[0070] Next, as shown in FIG6, after the hot press head 300A heats and pressurizes the transfer stamp 200A to transfer these first components onto the first portion of the back plate 102, the back plate 102 is moved such that the first portion of the back plate 102 overlaps with one or more low-temperature zones 120 on the normal of the stage 100, and the second portion of the back plate 102 overlaps with the high-temperature zone 110 on the normal of the stage 100. After the second portion of the back plate 102 overlaps with the high-temperature zone 110 on the normal of the stage 100, the hot press head 300A heats and pressurizes the transfer stamp 200A to transfer multiple second components (not shown) onto the second portion of the back plate 102.

[0071] FIG7 is a schematic diagram of a component transfer system 10B according to at least one embodiment of the present invention. Referring to FIG7, the component transfer system 10B includes a stage 100, a first hot press head 300, a first transfer stamp 200, and a first air cooling device 800B. The stage 100 is located in the hot press bonding area BS and is used to support the back plate 102. The first transfer stamp 200 is disposed on the first hot press head 300. The first hot press head 300 picks up a plurality of first components 400 located on the first temporary substrate 402 in the first pick-up area PS1 located on the first side of the hot press bonding area BS (e.g., the left side of the hot press bonding area BS in FIG7) by means of the first transfer stamp 200, and heats and pressurizes the first transfer stamp 200 in the hot press bonding area BS to transfer these first components 400 onto the back plate 102. The first air cooling device 800B is used to provide gas G to cool the first transfer stamp 200.

[0072] In other words, the main difference between the component transposition system 10B in FIG. 7 and the component transposition system 10 in FIG. 1 is that the first transposition stamp 200 does not need to be removed from the first hot press head 300 in the first waiting area WS1 and cooled before waiting to be absorbed by the first hot press head 300. Instead, the first transposition stamp 200, which is set on the first hot press head 300, is cooled by gas G provided by the first air cooling device 800B. In addition, most of the component structures and relative positional relationships of the embodiment in FIG. 7 and the embodiment in FIG. 1 are the same, so the same technical features will not be described again here.

[0073] By providing gas G through the first air cooling device 800B to cool the first transpose stamp 200 set on the first hot press head 300, the same transpose stamp can be prevented from overheating due to long-term high temperature. Therefore, the situation where the first component 400 and the back plate 102 cannot be stably connected due to overheating can be reduced, thereby improving the reliability and yield of the product.

[0074] Referring to FIG. 7, the component transfer system 10B further includes a second hot press head 600, a second transfer stamp 500, and a second air cooling device 900B. The second transfer stamp 500 is disposed on the second hot press head 600. The second hot press head 600 picks up a plurality of second components 700 located on the second pick-up area PS2 on the second side of the hot press bonding area BS relative to the first side (e.g., the right side of the hot press bonding area BS in FIG. 7) by means of the second transfer stamp 500. The second hot press head 600 heats and pressurizes the second transfer stamp 500 in the hot press bonding area BS to transfer these second components 700 onto the back plate 102. The second air cooling device 900B is used to provide gas to cool the second transfer stamp 500.

[0075] With the above design, when the first air cooling device 800B provides gas G to cool the first transfer stamp 200 disposed on the first hot press head 300, the second hot press head 600 can heat and pressurize the second transfer stamp 500 in the hot press bonding area BS to transfer these second components 700 onto the back plate 102, and vice versa, thereby improving process efficiency.

[0076] Since the first transfer stamp 200 of the component transfer system 10B in FIG7 does not need to be removed from the first hot press head 300 in the first waiting area WS1 and cooled before waiting to be absorbed by the first hot press head 300, but is cooled by gas G provided by the first air cooling device 800B, the component transfer method may not include the steps in FIG4A, FIG4B and FIG4H to FIG4J.

[0077] In detail, the above-described component transfer method includes the following steps, please refer to Figures 7 and 4C to 4G. A stage 100 is provided, which is located in the thermo-press bonding area BS. A back plate 102 is disposed on the stage 100. A first thermo-press head 300 and a first transfer stamp 200 disposed on the first thermo-press head 300 are provided. The first thermo-press head 300 picks up a plurality of first components 400 in a first pick-up area PS1 located on a first side of the thermo-press bonding area BS (e.g., the left side of the thermo-press bonding area BS in Figure 7) by means of the first transfer stamp 200 located on a first temporary substrate 402, and heats and pressurizes the first transfer stamp 200 in the thermo-press bonding area BS to transfer these first components 400 onto the back plate 102. A first air-cooling device 800B is provided to cool the first transpose stamp 200 after the first hot press head 300 heats and pressurizes the first transpose stamp 200 in the hot press bonding area BS to transfer these first elements 400 onto the back plate 102.

[0078] Furthermore, the above-described component transfer method may further include the following steps, please continue to refer to Figures 7 and 4C to 4G. A second hot press head 600 and a second transfer stamp 500 disposed on the second hot press head 600 are provided. The second hot press head 600 picks up a plurality of second components 700 located on the second temporary substrate 702 at the second pick-up area PS2 of the hot press bonding area BS relative to the first side (e.g., the right side of the hot press bonding area BS in Figure 7) by means of the second transfer stamp 500. When the first air cooling device 800B provides gas G to cool the first transfer stamp 200, the second hot press head 600 heats and pressurizes the second transfer stamp 500 at the hot press bonding area BS to transfer these second components 700 onto the back plate 102. A second air-cooling device 900B is provided to cool the second transpose stamp 500 after the second hot press head 600 heats and pressurizes the second transpose stamp 500 in the hot press bonding area BS to transfer these second elements 700 onto the back plate 102.

[0079] In some embodiments, the stage 100 of the above-described component transposition system 10B and the stage 100 provided by the above-described component transposition method can be the embodiment shown in FIG3, so the same technical features will not be described again here.

[0080] In summary, in the component transfer system and method of at least one embodiment of the present invention, by cooling the transfer stamp in the waiting area or by using an air-cooling device to cool the transfer stamp placed on the hot press head, the overheating of the same transfer stamp due to prolonged high temperature can be avoided. Furthermore, by heating the portion of the backplate currently being hot-pressed, while other portions of the backplate that have not yet been hot-pressed or have been hot-pressed are not heated, the overall overheating of the backplate can be avoided. Therefore, the possibility of unstable connection between the component and the backplate due to overheating can be reduced, thereby improving product reliability and yield.

[0081] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Those skilled in the art to which the present invention pertains may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims. [Simplified Explanation of the Diagram]

[0082] Figure 1 is a schematic diagram of a component transposition system according to at least one embodiment of the present invention. Figure 2 is a schematic diagram of a transport turntable according to at least one embodiment of the present invention. Figure 3 is a top view of a platform according to at least one embodiment of the present invention. Figures 4A to 4J are partial schematic diagrams of different steps in a component transposition method according to at least one embodiment of the present invention. Figures 5 and 6 are partial schematic diagrams of different steps in a component transposition system and method according to at least another embodiment of the present invention. Figure 7 is a schematic diagram of a component transposition system according to at least one embodiment of the present invention. [Biomaterial Storage]

[0084] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A component transposition system, comprising: A platform, located in a thermo-pressed bonding area, is used to support a backplate; One or more first transpose stamps are located in a first waiting area on a first side of the hot-press bonding area, wherein the one or more first transpose stamps are cooled in the first waiting area; and a first hot press head is used to pick up one of the one or more first transpose stamps in the first waiting area, and to heat and press one of the one or more first transpose stamps in the hot-press bonding area to transfer a plurality of first elements onto the back plate.

2. The component transfer system as claimed in claim 1 further includes a first transport turntable, wherein the first waiting area has a first cooling zone, a first air-cooling zone and a first preparation zone, the first transport turntable being used to transport one or more first transfer stamps sequentially to the first cooling zone for cooling, to the first air-cooling zone for cooling, and to the first preparation zone for waiting to be picked up by the first hot press head.

3. The component transposition system as claimed in claim 1, wherein the first hot press head picks up the first components in a first pick-up area located between the first waiting area and the hot press bonding area by means of one of the one or more first transposition stamps.

4. The component transposition system as described in claim 1, further comprising: One or more second transposed stamps are located in a second waiting area on a second side of the thermocompression bonding area relative to the first side, wherein the one or more second transposed stamps are cooled in the second waiting area; and a second thermocompression head is used to pick up one of the one or more second transposed stamps in the second waiting area and to heat and press one of the one or more second transposed stamps in the thermocompression bonding area to transfer a plurality of second elements onto the backplate.

5. The component transfer system as described in claim 4 further includes a second transport turntable, wherein the second waiting area has a second cooling zone, a second air-cooling zone and a second preparation zone, the second transport turntable being used to transport one or more second transfer stamps sequentially to the second cooling zone for cooling, to the second air-cooling zone for cooling, and to the second preparation zone for waiting to be picked up by the second hot press head.

6. The component transposition system as claimed in claim 4, wherein the second hot press head picks up the second components in a second pick-up area located between the second waiting area and the hot press bonding area by means of one of the one or more second transposition stamps.

7. The component transposition system as claimed in claim 1, wherein the stage has a high-temperature zone and one or more low-temperature zones adjacent to the high-temperature zone, and the temperature of the high-temperature zone is higher than the temperature of the one or more low-temperature zones, wherein a portion of the back plate overlaps with the high-temperature zone along a normal of the stage, and other portions of the back plate overlap with the one or more low-temperature zones.

8. The component transposition system as claimed in claim 7, wherein the stage further has a depletion region located between the high-temperature region and the one or more low-temperature regions, the depletion region being an air gap or a solid gap formed of a heat-resistant material.

9. A component transposition system, comprising: A platform, located in a thermo-pressed bonding area, is used to support a backplate; First hot press head; A first transpose stamp is disposed on the first hot press head, wherein the first hot press head picks up a plurality of first components in a first pick-up area on a first side of the hot press bonding area by means of the first transpose stamp, and heats and pressurizes the first transpose stamp in the hot press bonding area to transfer the first components to the back plate; and a first air cooling device is provided to provide gas to cool the first transpose stamp.

10. The component transposition system as described in claim 9, further comprising: A second hot press head; A second transpose stamp is disposed on the second hot press head, wherein the second hot press head picks up a plurality of second elements by means of the second transpose stamp in a second pick-up area on a second side of the hot press bonding area relative to the first side, and heats and pressurizes the second transpose stamp in the hot press bonding area to transfer the second elements to the back plate; and a second air cooling device is provided to provide gas to cool the second transpose stamp.

11. The component transposition system as claimed in claim 9, wherein the stage has a high-temperature zone and one or more low-temperature zones adjacent to the high-temperature zone, and the temperature of the high-temperature zone is higher than the temperature of the one or more low-temperature zones, wherein a portion of the back plate overlaps with the high-temperature zone along a normal of the stage, and other portions of the back plate overlap with the one or more low-temperature zones.

12. The component transposition system as claimed in claim 11, wherein the stage further has a depletion region located between the high-temperature region and the one or more low-temperature regions, the depletion region being an air gap or a solid gap formed of a heat-resistant material.

13. A method for transposing a component, comprising: A stage is provided, wherein the stage is located in a thermo-pressed bonding area; A backplate is disposed on the platform; one or more first transpose stamps are provided, wherein the one or more first transpose stamps are cooled in a first waiting area on a first side of the thermocompression bonding area; a first thermocompression head is provided to pick up one of the one or more first transpose stamps in the first waiting area; and after the first thermocompression head picks up one of the one or more first transpose stamps in the first waiting area, the first thermocompression head heats and pressurizes one of the one or more first transpose stamps in the thermocompression bonding area to transfer a plurality of first elements onto the backplate.

14. The component transposition method as described in claim 13 further includes: A first transport turntable is provided, wherein the first waiting area has a first cooling zone, a first air-cooling zone and a first preparation zone, and the first transport turntable transports one or more first transposed stamps sequentially to the first cooling zone for cooling, to the first air-cooling zone for cooling, and to the first preparation zone for waiting to be picked up by the first hot press head.

15. The component transposition method as described in claim 13 further includes: Before transferring the first components onto the backplate, the first hot press head picks up the first components in a first pick-up area located between the first waiting area and the hot press bonding area by means of one or more first transpose stamps.

16. The component transposition method as described in claim 13 further includes: One or more second transposed stamps are provided, wherein the one or more second transposed stamps are cooled in a second waiting area on a second side of the thermocompression bonding area relative to the first side; a second thermocompression head is provided, wherein when the first thermocompression head heats and presses one of the one or more first transposed stamps in the thermocompression bonding area to transfer a plurality of first elements onto the back plate, the second thermocompression head picks up one of the one or more second transposed stamps in the second waiting area; After the first hot press head heats and presses one of the one or more first transpose stamps in the hot press bonding area to transfer the first elements onto the back plate, the one or more first transpose stamps are removed from the first hot press head in the first waiting area; and after the second hot press head picks up one of the one or more second transpose stamps in the second waiting area, and while removing one of the one or more first transpose stamps from the first hot press head in the first waiting area, the second hot press head heats and presses one of the one or more second transpose stamps in the hot press bonding area to transfer a plurality of second elements onto the back plate.

17. The component transposition method as described in claim 16 further includes: A second transport turntable is provided, wherein the second waiting area has a second cooling zone, a second air-cooling zone and a second preparation zone, and the second transport turntable transports one or more second transfer stamps sequentially to the second cooling zone for cooling, to the second air-cooling zone for cooling, and to the second preparation zone for waiting to be picked up by the second hot press head.

18. The component transposition method as described in claim 16 further includes: Before transferring the second components onto the backplate, the second hot press head picks up the second components in a second pick-up area located between the second waiting area and the hot press bonding area by means of one or more second transpose stamps.

19. The component transposition method as claimed in claim 13, wherein the stage has a high-temperature zone and one or more low-temperature zones adjacent to the high-temperature zone, and the temperature of the high-temperature zone is higher than the temperature of the one or more low-temperature zones, wherein a first portion of the back plate overlaps with the high-temperature zone along a normal of the stage, and a second portion of the back plate overlaps with the one or more low-temperature zones.

20. The component transposition method as claimed in claim 19, wherein the stage further has a depletion region located between the high-temperature region and the one or more low-temperature regions, the depletion region being an air gap or a solid gap formed of a heat-resistant material.

21. A method for transposing a component, comprising: A stage is provided, wherein the stage is located in a thermo-pressed bonding area; A backplate is placed on the platform; A first hot press head and a first transfer stamp disposed on the first hot press head are provided, wherein the first hot press head picks up a plurality of first components in a first pick-up area located on a first side of the hot press bonding area using the first transfer stamp, and heats and pressurizes the first transfer stamp in the hot press bonding area to transfer the first components onto the back plate; and a first air cooling device is provided, wherein after the first hot press head heats and pressurizes the first transfer stamp in the hot press bonding area to transfer the first components onto the back plate, the first air cooling device provides gas to cool the first transfer stamp.

22. The component transposition method as described in claim 21 further comprises: providing a second hot press head and a second transposition stamp disposed on the second hot press head, wherein the second hot press head picks up a plurality of second components in a second pick-up area on a second side of the hot press bonding area relative to the first side via the second transposition stamp; while the first air cooling device provides gas to cool the first transposition stamp, the second hot press head heats and pressurizes the second transposition stamp in the hot press bonding area to transfer the second components onto the back plate; and providing a second air cooling device, after the second hot press head heats and pressurizes the second transposition stamp in the hot press bonding area to transfer the second components onto the back plate, the second air cooling device provides gas to cool the second transposition stamp.

23. The component transposition method as claimed in claim 21, wherein the stage has a high-temperature region, one or more low-temperature regions adjacent to the high-temperature region, and the temperature of the high-temperature region is higher than the temperature of the one or more low-temperature regions, wherein a first portion of the back plate overlaps with the high-temperature region along a normal of the stage, and a second portion of the back plate overlaps with the one or more low-temperature regions.

24. The component transposition method as claimed in claim 23, wherein the stage further has a depletion region located between the high-temperature region and the one or more low-temperature regions, the depletion region being an air gap or a solid gap formed of a heat-resistant material.

Images