Method for grabbing batch of wafers in processing solution

TW202641262APending Publication Date: 2026-10-01TSMC CHINA COMPANY +1
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Patent Information

Application Number
TW114121370
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-26
Filing Date
2025-06-06
Publication Date
2026-10-01

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Abstract

A method includes grabbing a gripping assembly and moving the gripping assembly into a processing solution. The batch of wafers in the processing solution is clamped by using the gripping assembly. The gripping assembly is locked. The gripping assembly with the batch of wafers is pulled out of the processing solution.
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