Substrate processing device
TW202641265APending Publication Date: 2026-10-01SCREEN HOLDINGS CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114143640
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-21
- Filing Date
- 2025-11-10
- Publication Date
- 2026-10-01
Smart Images

Figure TWG2TA001078461_001 
Figure TWG2TA001078461_002 
Figure TWG2TA001078461_003
Abstract
The present invention provides a substrate processing apparatus that can prevent substrate breakage under high-pressure cleaning and reduce substrate transport defects. The cleaning apparatus includes: a conveying mechanism for conveying the substrate; and a high-pressure nozzle for spraying fluid at high pressure from above the substrate conveyed by the conveying mechanism. Among the plurality of conveying rollers of the conveying mechanism, the opposing roller (22) which is the conveying roller positioned opposite to the high-pressure nozzle has a rotation axis (22a) and a plurality of roller members (22b) installed with gaps between them along the rotation axis. The width dimension of the roller members in the direction extending along the rotation axis is greater than the width dimension of the gaps.
Need to check novelty before this filing date? Find Prior Art
