Wafer transfer device

Abstract

A wafer transfer device comprises a first wall, a second wall, a third wall, a first supporting base, and a second supporting base. The second wall is substantially parallel to the first wall and spaces apart from each other in a first direction. The third wall is connected between the first wall and the second wall. The first supporting base is connected to a bottom of the first wall and extending toward the second wall. The first supporting base has a first contact surface. The second supporting base is connected to a bottom of the second wall and extending toward the first wall. The second supporting base has a second contact surface substantially coplanar with the first contact surface. Each of the first contact surface and the second contact surface has a width equal to or less than

Description

Technical Field

[0001] This disclosure relates to a wafer transfer apparatus. Specifically, this disclosure relates to a highly stable manual wafer transfer apparatus that does not contaminate or damage the wafer. Prior Technology

[0002] In the wafer manufacturing process, if it is necessary to manually remove defective wafers, a "vacuum pen" or "wafer jig" is usually used to remove the defective wafer and place it in a wafer transfer box for subsequent evaluation and procedures. However, "vacuum pens" or "wafer jigs" are prone to contamination or damage to the wafer due to hand movement or instability.

[0003] Therefore, a wafer transfer device that can solve the above problems is needed. Summary of the Invention

[0004] This disclosure relates to a wafer transfer apparatus, comprising a first sidewall, a second sidewall, a third sidewall, a first support substrate, and a second support substrate. The second sidewall is substantially parallel to the first sidewall and spaced apart from it in a first direction. The third sidewall is connected between the first and second sidewalls. The first support substrate is connected to the bottom of the first sidewall and extends toward the second sidewall. The first support substrate has a first contact surface. The second support substrate is connected to the bottom of the second sidewall and extends toward the first sidewall. The second support substrate has a second contact surface substantially coplanar with the first contact surface. The first and second contact surfaces have a width equal to or less than about 6 mm in the first direction.

[0005] In some embodiments disclosed herein, the wafer transfer apparatus further includes a third support substrate. The third support substrate is connected to the bottom of the third sidewall and extends away from the third sidewall. The third support substrate has a third contact surface that is substantially coplanar with the first contact surface. The third contact surface has a width equal to or less than about 6 mm in a first direction.

[0006] In some embodiments disclosed herein, the length of the first sidewall in the second direction and the length of the second sidewall in the second direction are greater than the length of the third sidewall in the first direction. The second direction is perpendicular to the first direction.

[0007] In some embodiments disclosed herein, the first sidewall, the second sidewall, and the third sidewall form a U-shape.

[0008] In some embodiments disclosed herein, the wafer transfer apparatus further includes a stabilizing structure. The stabilizing structure is connected to the top of the first sidewall and the top of the second sidewall. The top and bottom of the first sidewall are located on opposite sides of the first sidewall. The top and bottom of the second sidewall are located on opposite sides of the second sidewall.

[0009] In some embodiments disclosed herein, the stabilizing structure and the third side wall are located on opposite sides of the first side wall and the second side wall, respectively.

[0010] In some embodiments disclosed herein, the first sidewall, the second sidewall, the third sidewall, and the stabilizing structure form a rectangle.

[0011] In some embodiments disclosed herein, the wafer transfer apparatus further includes a handle connected to a third sidewall.

[0012] This disclosure also relates to a wafer transfer apparatus, comprising a first sidewall, a second sidewall, a third sidewall, a first support substrate, and a second support substrate. The second sidewall is substantially parallel to the first sidewall and spaced apart from it in a first direction. The third sidewall is connected between the first and second sidewalls. The first support substrate is connected to the bottom of the first sidewall and extends toward the second sidewall. The first support substrate has a first bottom surface and a first inclined surface. The first inclined surface is inclined at an angle relative to the first bottom surface. The second support substrate is connected to the bottom of the second sidewall and extends toward the first sidewall. The second support substrate has a second bottom surface and a second inclined surface. The second inclined surface is inclined at an angle relative to the second bottom surface.

[0013] In some embodiments disclosed herein, the angle between the first inclined plane and the first bottom surface is less than about 10 degrees. The angle between the second inclined plane and the second bottom surface is less than about 10 degrees.

[0014] In some embodiments disclosed herein, the second bottom surface is substantially coplanar with the first bottom surface.

[0015] In some embodiments disclosed herein, the wafer transfer apparatus further includes a third support substrate. The third support substrate is connected to the bottom of the third sidewall and extends away from the third sidewall. The third support substrate has a third bottom surface and a third inclined surface. The third inclined surface is inclined at an angle relative to the third bottom surface.

[0016] In some embodiments disclosed herein, the angle between the third inclined plane and the third bottom plane is less than about 10 degrees.

[0017] In some embodiments disclosed herein, the third bottom surface is substantially coplanar with the first bottom surface and the second bottom surface.

[0018] In some embodiments disclosed herein, the wafer transfer apparatus further includes a stabilizing structure. The stabilizing structure is connected to the top of the first sidewall and the top of the second sidewall. The top and bottom of the first sidewall are located on opposite sides of the first sidewall. The top and bottom of the second sidewall are located on opposite sides of the second sidewall.

[0019] In some embodiments disclosed herein, the stabilizing structure and the third sidewall are located at opposite ends of the first sidewall and the second sidewall, respectively.

[0020] In some embodiments disclosed herein, the wafer transfer apparatus further includes a handle connected to a third sidewall.

[0021] In summary, the wafer transfer apparatus disclosed herein minimizes the risk of contamination or damage due to human error during manual wafer handling. Furthermore, by lifting the wafer upwards through contact surfaces that reach inactive areas of the wafer, the wafer transfer apparatus significantly reduces the risk of the operator's hands touching the wafer.

[0022] It should be understood that the above general description and the following detailed description are merely examples intended to further explain the content of this disclosure. Simple Explanation of the Diagram

[0023] A more complete understanding of this disclosure can be achieved by referring to the following figures and reading the detailed description of the embodiments herein: Figure 1 is a schematic diagram of a wafer transfer apparatus according to some embodiments of the present disclosure. Figure 2 is a side view of a wafer transfer apparatus according to some embodiments of the present disclosure. Figure 3 is a schematic diagram of a wafer transfer apparatus including a wafer according to some embodiments of the present disclosure. Figure 4 is a schematic diagram of a wafer transfer apparatus according to some embodiments of the present disclosure. Figure 5 is a side view of a wafer transfer apparatus including a wafer according to some embodiments of the present disclosure. Figure 6 is a schematic flowchart of a process for removing defective wafers according to some embodiments of this disclosure. Implementation

[0024] Reference will now be made in detail to embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Where possible, the same element symbols are used in the drawings and description to refer to the same or similar parts.

[0025] It should be understood that when referring to a component or layer as "connected to" or "coupled to" another component or layer, it can be a direct connection or coupling, or it can be a case where there are intermediate components or layers.

[0026] To clearly explain the relative positions or arrangements of the various components, coordinate axes will be shown in the diagram, namely the first axis A1, the second axis A2, and the third axis A3.

[0027] During wafer manufacturing, if the automatic reset system malfunctions, rendering the robotic arm inoperable, and a defective wafer is detected, the defective wafer must be manually removed. Typically, when manually removing a defective wafer, the operator uses a wafer transfer device to extract the defective wafer from the production line and place it into an empty wafer transport container for further processing.

[0028] To reduce or even eliminate the risk of operators accidentally coming into contact with wafers during manual handling, this disclosure provides a wafer transfer device. The wafer transfer device is capable of vertically lifting a defective wafer from below at a location on the production line where an anomaly occurs and safely placing it into a wafer transport container, or returning it to its original position after inspection.

[0029] Please refer to Figures 1, 2, and 3. Figure 1 is a schematic diagram of a wafer transfer apparatus 100 according to some embodiments of this disclosure. Figure 2 is a side view of a wafer transfer apparatus 100 according to some embodiments of this disclosure. Figure 3 is a schematic diagram of a wafer transfer apparatus 100 including a wafer 300 according to some embodiments of this disclosure. In some embodiments of this disclosure, as shown in Figure 3, the wafer 300 is a 12-inch wafer, but this disclosure is not limited thereto. In some embodiments of this disclosure, the size of the wafer transfer apparatus 100 can be adjusted according to the size of the wafer 300.

[0030] In some embodiments disclosed herein, as shown in Figures 1 and 2, the wafer transfer apparatus 100 includes a first sidewall 110, a second sidewall 120, a third sidewall 130, a first support substrate 113, and a second support substrate 123. The second sidewall 120 is substantially parallel to the first sidewall 110 and is spaced apart from each other in a first direction. The third sidewall 130 is connected between the first sidewall 110 and the second sidewall 120. The first support substrate 113 is connected to the bottom 111 of the first sidewall 110 and extends toward the second sidewall 120. The second support substrate 123 is connected to the bottom 121 of the second sidewall 120 and extends toward the first sidewall 110. The first direction is along a first axial direction A1.

[0031] In some embodiments of this disclosure, the first support substrate 113 has a first contact surface 114. In some embodiments of this disclosure, the second support substrate 123 has a second contact surface 124 that is substantially coplanar with the first contact surface 114. In some embodiments of this disclosure, the first contact surface 114 and the second contact surface 124 have a width W equal to or less than about 6 mm in a first direction. In some embodiments of this disclosure, the first contact surface 114 and the second contact surface 124 have a width W equal to or less than about 3 mm in the first direction. For example, the width W of the first contact surface 114 and the second contact surface 124 can be about 3 mm, about 4 mm, about 5 mm, or about 6 mm.

[0032] Specifically, the contact surfaces of the wafer transfer device 100 are designed to contact the ineffective area of ​​the outermost edge of the wafer 300. Generally, the ineffective area of ​​the wafer 300, measured from the outermost edge towards the center, is typically within a range of about 3 millimeters. Therefore, considering the dimensions of the wafer transfer device 100 and the wafer 300, the width W of the first contact surface 114 and the second contact surface 124 of the wafer transfer device 100 is preferably less than about 6 millimeters.

[0033] In some embodiments of this disclosure, as shown in Figure 1, the wafer transfer apparatus 100 further includes a third support substrate 133. The third support substrate 133 is connected to the bottom 131 of the third sidewall 130 and extends away from the third sidewall 130. In some embodiments of this disclosure, the third support substrate 133 has a third contact surface 134 that is substantially coplanar with the first contact surface 114. In some embodiments of this disclosure, the third contact surface 134 has a width W equal to or less than about 6 mm in a first direction. In some embodiments of this disclosure, the third contact surface 134 has a width W equal to or less than about 3 mm in the first direction. For example, the width W of the third contact surface 134 can be about 3 mm, about 4 mm, about 5 mm, or about 6 mm. The second direction is along the second axial direction A2.

[0034] In some embodiments of this disclosure, the lengths L1 of the first sidewall 110 and L2 of the second sidewall 120 in the second direction are greater than the length L3 of the third sidewall 130 in the first direction. Because the lengths L1 and L2 of the first sidewall 110 and the second sidewall 120 are greater than the length L3 of the third sidewall 130, the wafer is less likely to fall from the notch away from the third sidewall 130 during transport. This enhances the stability of the wafer transfer apparatus 100. In some embodiments of this disclosure, the first sidewall 110, the second sidewall 120, and the third sidewall 130 form a U-shape.

[0035] In some embodiments of this disclosure, as shown in Figures 1 and 2, the wafer transfer apparatus 100 further includes a stabilizing structure 140. The stabilizing structure 140 is connected to the top 112 of the first sidewall 110 and the top 122 of the second sidewall 120. The top 112 and bottom 111 of the first sidewall 110 are located on opposite sides of the first sidewall 110. The top 122 and bottom 121 of the second sidewall 120 are located on opposite sides of the second sidewall 120. In some embodiments of this disclosure, the stabilizing structure 140 and the third sidewall 130 are located on opposite sides of the first sidewall 110 and the second sidewall 120, respectively. The stabilizing structure 140 is used to enhance the structural strength of the wafer transfer apparatus 100, preventing the ends of the first sidewall 110 and the second sidewall 120 away from the third sidewall 130 from wobbling due to insufficient structural strength. In some embodiments of this disclosure, the first sidewall 110, the second sidewall 120, the third sidewall 130, and the stabilizing structure 140 form a rectangle.

[0036] In some embodiments disclosed herein, as shown in Figure 1, the wafer transfer apparatus 100 further includes a handle 150 connected to a third sidewall 130. The handle 150 is configured to allow an operator to use the wafer transfer apparatus 100 in a convenient manner.

[0037] Please refer to Figures 4 and 5. Figure 4 is a schematic diagram of a wafer transfer apparatus 200 according to some embodiments of the present disclosure. Figure 5 is a side view of a wafer transfer apparatus 200 including a wafer 300 according to some embodiments of the present disclosure.

[0038] In some embodiments disclosed herein, as shown in Figure 4, the wafer transfer apparatus 200 includes a first sidewall 210, a second sidewall 220, a third sidewall 230, a first support substrate 213, and a second support substrate 223. The configuration of the wafer transfer apparatus 200 with respect to the first sidewall 210, the second sidewall 220, the third sidewall 230, the first support substrate 213, and the second support substrate 223 is the same as that of the wafer transfer apparatus 100, and will not be described again here.

[0039] In some embodiments disclosed herein, as shown in Figure 4, a first support substrate 213 is connected to the bottom 211 of a first sidewall 210 and extends toward a second sidewall 220. In some embodiments disclosed herein, the first support substrate 213 has a first bottom surface 2132 and a first inclined surface 2131. The first inclined surface 2131 is inclined at an angle relative to the first bottom surface 2132. In some embodiments disclosed herein, as shown in Figure 4, a second support substrate 223 is connected to the bottom 221 of a second sidewall 220 and extends toward a first sidewall 210. The second support substrate 223 has a second bottom surface 2232 and a second inclined surface 2231. The second inclined surface 2231 is inclined at an angle relative to the second bottom surface 2232. In some embodiments disclosed herein, the second bottom surface 2232 is substantially coplanar with the first bottom surface 2132.

[0040] In some embodiments disclosed herein, as shown in Figure 5, the angle between the first inclined surface 2131 and the first bottom surface 2132 is less than approximately 10 degrees. The angle between the second inclined surface 2231 and the second bottom surface 2232 is also less than approximately 10 degrees. For example, the angle can be approximately 9 degrees, approximately 8 degrees, approximately 7 degrees, approximately 6 degrees, approximately 5 degrees, approximately 4 degrees, approximately 3 degrees, approximately 2 degrees, or approximately 1 degree. Specifically, the wafer transfer apparatus 200 can more easily handle the wafer 300 by forming certain angles between the first inclined surface 2131 and the second inclined surface 2231 and the first bottom surface 2132 and the second bottom surface 2232, respectively.

[0041] In some embodiments of this disclosure, as shown in Figure 4, the wafer transfer apparatus 200 further includes a third support substrate 233. The third support substrate 233 is connected to the bottom 231 of the third sidewall 230 and extends away from the third sidewall 230. The third support substrate 233 has a third bottom surface 2332 and a third inclined surface 2331. The third inclined surface 2331 is inclined at an angle relative to the third bottom surface 2332. In some embodiments of this disclosure, the third bottom surface 2332 is substantially coplanar with the first bottom surface 2132 and the second bottom surface 2232.

[0042] In some embodiments disclosed herein, the angle between the third inclined surface 2331 and the third bottom surface 2332 is less than about 10 degrees. For example, the angle can be about 9 degrees, about 8 degrees, about 7 degrees, about 6 degrees, about 5 degrees, about 4 degrees, about 3 degrees, about 2 degrees, or about 1 degree. Specifically, the wafer transfer apparatus 200 can more easily handle the wafer 300 by forming an angle between the third inclined surface 2331 and the third bottom surface 2332.

[0043] In some embodiments disclosed herein, the wafer transfer apparatus 200 further includes a stabilizing structure 240. The stabilizing structure 240 is connected to the top 212 of the first sidewall 210 and the top 222 of the second sidewall 220. The top 212 and bottom 211 of the first sidewall 210 are located on opposite sides of the first sidewall 210. The top 222 and bottom 221 of the second sidewall 220 are located on opposite sides of the second sidewall 220. In some embodiments disclosed herein, the stabilizing structure 240 and the third sidewall 230 are located at opposite ends of the first sidewall 210 and the second sidewall 220, respectively.

[0044] In some embodiments disclosed herein, the wafer transfer apparatus 200 further includes a handle 250 connected to a third sidewall 230. The handle 250 is configured to allow an operator to use the wafer transfer apparatus 200 in a convenient manner.

[0045] Please refer to Figure 6, which is a schematic flowchart of a defective wafer removal process according to some embodiments of this disclosure. The defective wafer removal process shown in this disclosure demonstrates that the original defective wafer handling process has been improved after using the wafer transfer apparatus disclosed herein.

[0046] The defective wafer removal process begins at step S101, when a defective wafer is generated and detected during wafer manufacturing. If the equipment's automatic recovery system fails and the robotic arm is inoperable, the defective wafer must be removed manually.

[0047] The defective wafer removal process continues to step S102. The operator uses a wafer transfer device to remove the defective wafer from the production line and place it into an empty wafer transport container for further processing.

[0048] The defective wafer removal process continues to step S103. The wafer transport box containing the defective wafer is transferred to the processing unit to determine the subsequent processing.

[0049] Next, based on the determination result, a decision will be made to continue with either step S104 or step S105. If the determination result indicates that the wafer is normal, the wafer transfer device disclosed herein will be used to return the wafer to its original location. If the determination result confirms that the wafer is defective, it will be transferred to another device for further processing and reused for non-production applications.

[0050] Although the above process is illustrated and diagrammed as a series of steps or events, it should be understood that the sequence of steps or events illustrated should not be interpreted as limiting. For example, some steps may occur in a different order than those illustrated and / or described herein, and / or may occur simultaneously with other steps or events. Furthermore, not all illustrated steps are necessary to implement one or more aspects or embodiments of this description. Moreover, one or more steps depicted herein may also be performed as one or more independent steps and / or stages.

[0051] In other words, when an abnormal wafer is detected on the production line, the operator uses the wafer transfer device disclosed herein to transfer the abnormal wafer to a wafer transport cassette and then send it to the relevant unit for testing. If the test results show that the wafer is normal, it is then sent back to its original position using the wafer transfer device disclosed herein. If the test results confirm that the wafer has a problem, it is transferred to another unit for further processing and reused for non-production purposes.

[0052] By using the wafer transfer device disclosed herein, the risk of operators accidentally touching the wafer can be avoided. Therefore, the handling process for defective wafers no longer needs to consider the risk of scrapping due to human error. This further reduces personnel risks, decreases wafer damage rates, shortens defect handling time, and improves work efficiency.

[0053] In summary, the wafer transfer apparatus disclosed herein ensures that the risk of contamination or damage due to human error is minimized during manual wafer handling. Furthermore, because the wafer transfer apparatus disclosed herein contacts the inactive annular region of the wafer through a contact surface and lifts the wafer, it significantly reduces the risk of operators directly contacting the wafer with their hands.

[0054] Although this disclosure has described in detail with reference to certain embodiments, other embodiments are also possible. Therefore, the spirit and scope of the claims should not be limited to the embodiments described herein.

[0055] Those skilled in the art will understand that various modifications and variations can be made to the structure of this disclosure without departing from its scope or spirit. In view of the foregoing, this disclosure is intended to cover modifications and variations within the scope of the following patent applications.

[0056] 100, 200: Wafer transfer device 110,210: First side wall 113, 213: First support substrate 114: First contact surface 2131: First inclined plane 2132: First base 120, 220: Second side wall 123,223: Second support substrate 124: Second contact surface 2231:Second slope 2232: Second base 130, 230: Third side wall 133,233: Third support substrate 134: Third contact surface 2331: Third inclined plane 2332: Third base 111,211,121,221,131,231: Bottom 112,212,122,222,132,232: Top 140, 240: Stable structure 150, 250: Handle 300: Wafer L1, L2, L3: Length W: Width A1: First Axial Direction A2: Second Axial Direction A3: Third Axis S101, S102, S103, S104, S105: Steps

[0057] Domestic storage information (please note in order of storage institution, date, and number) none Overseas storage information (please note in the order of storage country, institution, date, and number) none

Claims

1. A wafer transfer apparatus, comprising: First side wall; A second sidewall, substantially parallel to the first sidewall and spaced apart from the first sidewall in a first direction; a third sidewall, connecting the first sidewall and the second sidewall; a first support base plate, connected to a bottom of the first sidewall and extending toward the second sidewall, the first support base plate having a first contact surface; And a second support substrate, connected to a bottom of the second sidewall and extending toward the first sidewall, the second support substrate having a second contact surface, wherein the first contact surface and the second contact surface are substantially coplanar; wherein the first contact surface and the second contact surface each have a width equal to or less than about 6 mm in the first direction.

2. The wafer transfer apparatus as claimed in claim 1, further comprising a third support substrate connected to a bottom of the third sidewall and extending away from the third sidewall, wherein the third support substrate has a third contact surface substantially coplanar with the first contact surface, and the third contact surface has a width equal to or less than about 6 millimeters in a second direction, wherein the second direction is perpendicular to the first direction.

3. The wafer transfer apparatus as claimed in claim 1, wherein a length of the first sidewall in a second direction and a length of the second sidewall in the second direction are greater than a length of the third sidewall in the first direction, wherein the second direction is perpendicular to the first direction.

4. The wafer transfer apparatus as claimed in claim 1, wherein the first sidewall, the second sidewall, and the third sidewall form a U-shape.

5. The wafer transfer apparatus as claimed in claim 1, further comprising a stabilizing structure connecting a top of the first sidewall and a top of the second sidewall, wherein the top and bottom of the first sidewall are located on opposite sides of the first sidewall, and the top and bottom of the second sidewall are located on opposite sides of the second sidewall.

6. The wafer transfer apparatus as claimed in claim 5, wherein the stabilizing structure and the third sidewall are located at opposite ends of the first sidewall and the second sidewall, respectively.

7. The wafer transfer apparatus as claimed in claim 6, wherein the first sidewall, the second sidewall, the third sidewall, and the stabilizing structure form a rectangle.

8. The wafer transfer apparatus as described in claim 1, further comprising a handle connected to the third sidewall.

9. A wafer transfer apparatus, comprising: First side wall; A second sidewall, substantially parallel to the first sidewall and spaced apart from the first sidewall in a first direction; a third sidewall, connecting the first sidewall and the second sidewall; a first support base plate, connected to a bottom of the first sidewall and extending toward the second sidewall, the first support base plate having a first bottom surface and a first inclined surface, the first inclined surface being inclined at an angle relative to the first bottom surface; And a second support base plate, which is connected to a bottom of the second side wall and extends toward the first side wall. The second support base plate has a second bottom surface and a second inclined surface, and the second inclined surface is inclined at an angle relative to the second bottom surface.

10. The wafer transfer apparatus as described in claim 9, wherein the angle is less than about 10 degrees.

11. The wafer transfer apparatus as claimed in claim 9, wherein the second bottom surface is substantially coplanar with the first bottom surface.

12. The wafer transfer apparatus of claim 9 further includes a third support substrate connected to a bottom of the third sidewall and extending away from the third sidewall, the third support substrate having a third bottom surface and a third inclined surface, the third inclined surface being inclined at an angle relative to the third bottom surface.

13. The wafer transfer apparatus as described in claim 12, wherein the angle is less than about 10 degrees.

14. The wafer transfer apparatus as claimed in claim 12, wherein the third bottom surface is substantially coplanar with the first bottom surface and the second bottom surface.

15. The wafer transfer apparatus of claim 9 further includes a stabilizing structure connecting a top of the first sidewall and a top of the second sidewall, wherein the top and bottom of the first sidewall are located on opposite sides of the first sidewall, and the top and bottom of the second sidewall are located on opposite sides of the second sidewall.

16. The wafer transfer apparatus as claimed in claim 15, wherein the stabilizing structure and the third sidewall are located at opposite ends of the first sidewall and the second sidewall, respectively.

17. The wafer transfer apparatus as described in claim 9, further comprising a handle connected to the third sidewall.

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