Methods for manufacturing transport devices, semiconductor manufacturing equipment, and semiconductor devices

TW202641277APending Publication Date: 2026-10-01KIOXIA CORP
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Patent Information

Application Number
TW114131055
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-18
Filing Date
2025-08-14
Publication Date
2026-10-01

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Abstract

To prevent unnecessary contact between the semiconductor wafer and the transporter caused by warping of the semiconductor wafer, the transport device includes: a transporter for transporting the semiconductor wafer, a guide connected to the transporter and supporting the semiconductor wafer, and a component disposed below the guide that can adjust the height of the contact point between the guide and the semiconductor wafer according to the warping shape of the semiconductor wafer.
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