Methods and apparatus for inspecting the device

Abstract

A method for inspecting a wire bonding apparatus includes: step S2, placing a capillary tube in contact with the nth substrate electrode; step S3, outputting a drive current comprising an alternating current component scanning from a lower frequency limit to an upper frequency limit; steps S4 and S5, during the scanning step S3, obtaining an output value as a result of the capillary tube moving along the axis due to the force generated by the drive current; and step S7, using the input and output values ​​obtained from the drive current command to obtain the nth frequency response. The preparation step S1, the scanning step S3, the acquisition steps S4 and S5, and the calculation step S7 are repeated while changing locations from the 1st substrate electrode to the Nth substrate electrode, thereby obtaining the 1st to Nth frequency responses.

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