laminated body

Abstract

The present invention provides a multilayer assembly capable of effectively dissipating heat from electronic components while suppressing the increase in size and weight. The multilayer assembly (1A) includes: a heat dissipation component (2A); an insulating layer (3) disposed on the surface of the heat dissipation component (2A); a metal circuit pattern (4) disposed on the surface of the insulating layer (3); and a first electronic component (5) disposed on a portion of the surface of the heat dissipation component (2A) where the insulating layer (3) is not disposed. The first electronic component (5) has a heat dissipation electrode (5a) on its back side connected to the surface of the heat dissipation component (2A) and electrically connected to the metal circuit pattern (4). The back side of the first electronic component (5), including the heat dissipation electrode (5a), is electrically insulated from the interior of the first electronic component (5).

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