Heat dissipation structure

Abstract

The present invention aims to provide a heat dissipation structure comprising a circuit board that enhances the freedom of circuit design and also provides good thermal conductivity. A heat dissipation structure includes: a heat-generating element supported on a substrate; a heat-conducting member for conducting heat generated from the heat-generating element; and a first thermally conductive bonding material for bonding the heat-conducting member to the heat-generating element. The heat-conducting member comprises at least one molded body containing a carbon fiber composite material, the molded body having anisotropy including a high thermal conductivity direction representing a first thermal conductivity and a low thermal conductivity direction representing a second thermal conductivity lower than the first thermal conductivity. The heat-conducting member includes a first molded body disposed to extend along one of the planar directions of the substrate, the first molded body being disposed such that the high thermal conductivity direction is along said direction.

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