Semiconductor devices and semiconductor memory devices

Abstract

This invention provides a semiconductor device and a semiconductor memory device capable of suppressing temperature rise in semiconductor wafers. The semiconductor device includes: a plurality of first semiconductor wafers stacked in a vertical direction; a first wafer-on-a-piece member disposed on the upper surface of the lower first semiconductor wafer between two adjacent first semiconductor wafers in the vertical direction; and a plurality of second semiconductor wafers disposed on the upper surface of each of the plurality of first semiconductor wafers, wherein the first wafer-on-a-piece member includes a thermally conductive member having a higher thermal conductivity than the second semiconductor wafers.

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