Plasma treatment apparatus and plasma treatment method

TW202641335APending Publication Date: 2026-10-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115106357
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-09-10
Filing Date
2026-02-23
Publication Date
2026-10-01

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Abstract

This invention aims to provide a plasma processing apparatus comprising: a plasma processing chamber; a base disposed within the plasma processing chamber, with an electrostatic chuck disposed on the upper part of the base; at least one control board disposed within the internal space of the base; a heat transfer medium supply section including at least one heat transfer medium supply port for supplying gaseous heat transfer medium to the internal space; and a heat transfer medium discharge section including at least one heat transfer medium discharge port for discharging the heat transfer medium from the internal space; the heat transfer medium discharge port is disposed at a position higher than the top surface of the at least one control board. Therefore, the plasma processing apparatus can effectively suppress the temperature rise of the control board disposed within the internal space of the base.
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