Semiconductor device transfer method and semiconductor device transfer apparatus

TW202641344APending Publication Date: 2026-10-01TORAY ENG CO LTD
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Patent Information

Application Number
TW114152107
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-19
Filing Date
2025-12-31
Publication Date
2026-10-01

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Abstract

This invention provides a semiconductor device transfer method that protects a semiconductor device from impacts applied to it during transfer. Specifically, the semiconductor device transfer method includes the following steps: irradiating the transfer substrate Cr1 with laser light L from the side opposite to the surface of the semiconductor device C to which it is adhered, and transferring the semiconductor device C to the substrate Cr2 while the adhesive layer A1 is retained on the surface of the semiconductor device C.
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