Semiconductor package
TW202641346APending Publication Date: 2026-10-01MEDIATEK INC
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114151942
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-12-22
- Filing Date
- 2025-12-30
- Publication Date
- 2026-10-01
Smart Images
Figure TWG2TA001078918_001 
Figure TWG2TA001078918_002 
Figure TWG2TA001078918_003
Abstract
A semiconductor package is provided. The semiconductor package includes a glass carrier, a redistribution layer (RDL) structure, a first die, a molding compound and a plurality of conductive ball structures. The RDL structure is directly disposed on a first surface of the glass carrier. The first die is mounted on the RDL structure. The molding compound is disposed on the RDL structure and surrounding the first die. The plurality of conductive ball structures is disposed on a second surface of the glass carrier. The second surface is opposite the first surface.
Need to check novelty before this filing date? Find Prior Art