Electronic devices and methods of manufacturing electronic devices

Abstract

In one example, an electronic device includes an electronic component including an upper side, a lower side, a lateral side, and component interconnects adjacent to the upper side. An encapsulant includes an encapsulant top side, an encapsulant lower side, and an encapsulant lateral side. A substrate includes a dielectric structure including a first dielectric layer and a second dielectric layer over the first dielectric layer and comprising a lateral end interposed between the lateral side of the electronic component and the encapsulant lateral side. The substrate includes a conductive structure including a first conductive layer and a second conductive layer coupled to the first conductive layer. The second conductive layer comprises a substrate edge terminal comprising a first portion that extends to overlap the lateral end of the second dielectric layer and covers a part of the first dielectric layer. Other examples and related methods are also disclosed herein.

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