Semiconductor package including a redistribution substrate

Abstract

A semiconductor package according to embodiments of the present disclosure includes a package substrate; a redistribution substrate bonded to the package substrate by a first bump, and including a dielectric layer and redistribution patterns; a first underfill layer filled in the space between the package substrate and the redistribution substrate; a semiconductor chip bonded to the redistribution substrate by a second bump; and a first molding layer disposed on the redistribution substrate, and surrounding the semiconductor chip, wherein the dielectric layer includes a negative tone dielectric layer that includes polyimide at a mass ratio of

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