Semiconductor structure

TW202641361APending Publication Date: 2026-10-01UNITED MICROELECTRONICS CORP
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Patent Information

Application Number
TW115109401
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-26
Publication Date
2026-10-01

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Abstract

A semiconductor structure includes a substrate having a bump pad thereon and a passivation layer disposed on the substrate. The passivation layer covers a perimeter of the bump pad and has a slot-shaped opening exposing a central region of the bump pad. An under bump metal (UBM) layer is disposed on the central region of the bump pad. A solder bump is disposed on the UBM layer. The solder bump has a flat top surface area.
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