Substrate assembly and assembly package
TW202641364APending Publication Date: 2026-10-01PANELSEMI CORP
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Patent Information
- Application Number
- TW114148488
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-25
- Filing Date
- 2025-12-10
- Publication Date
- 2026-10-01
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Figure TWG2TA001078761_001 
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Abstract
A substrate assembly is disclosed, comprising a carrier board defining a planar direction and a plurality of substrates adjacently arranged thereon. Each substrate has opposite first and second surfaces, with a temporary adhesive layer bonding the second surface to the carrier board. A functional material fills the gaps between adjacent substrates. The carrier board's area is no less than the total area of the substrates. Crucially, in a direction perpendicular to the planar direction, the height difference between the first surfaces or the second surfaces of adjacent substrates is controlled to be no greater than
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