Substrate assembly and assembly package

TW202641364APending Publication Date: 2026-10-01PANELSEMI CORP
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Patent Information

Application Number
TW114148488
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-25
Filing Date
2025-12-10
Publication Date
2026-10-01

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    Figure TWG2TA001078761_003
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Abstract

A substrate assembly is disclosed, comprising a carrier board defining a planar direction and a plurality of substrates adjacently arranged thereon. Each substrate has opposite first and second surfaces, with a temporary adhesive layer bonding the second surface to the carrier board. A functional material fills the gaps between adjacent substrates. The carrier board's area is no less than the total area of the substrates. Crucially, in a direction perpendicular to the planar direction, the height difference between the first surfaces or the second surfaces of adjacent substrates is controlled to be no greater than
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