Circuit board and manufacturing method thereof

Abstract

A circuit board and a manufacturing method thereof, where the circuit board includes a glass substrate, a first build-up layer, and at least one crack blocking structure. The glass substrate has a bottom surface, a top surface and a first side surface. The bottom surface and the top surface face away from each other. The first side surface connects the bottom surface and the top surface. The first build-up layer is disposed on the bottom surface or the top surface. The at least one crack blocking structure is disposed in the glass substrate and located adjacent to the first side surface.

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