Integrated circuit device including a power via
TW202641370APending Publication Date: 2026-10-01SAMSUNG ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114144732
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-19
- Filing Date
- 2025-11-17
- Publication Date
- 2026-10-01
Smart Images

Figure TWG2TA001078509_001 
Figure TWG2TA001078509_002 
Figure TWG2TA001078509_003
Abstract
An integrated circuit includes: a cell transistor including: a nanosheet stack including nanosheets spaced apart from each other in a vertical direction; a gate electrode on the nanosheet stack and extending in a horizontal direction; and a first source / drain region connected to the nanosheet stack; a back contact beneath the cell transistor and connected to the first source / drain region; a first power via at a vertical level lower than that of the back contact and connected to the back contact; a front wiring structure on and connected to the cell transistor; and a back wiring structure beneath the first power via and connected to the cell transistor. The back wiring structure is configured such that connected to the first power via and the back contact. And a lower surface of the first power via does not overlap the back contact in the vertical direction and includes a recess.
Need to check novelty before this filing date? Find Prior Art
