Semiconductor devices, semiconductor systems, and methods for manufacturing semiconductor devices

Abstract

This invention suppresses cracking of solder balls. A semiconductor device according to an embodiment includes: a wiring substrate having a first surface and a second surface opposite to the first surface; a semiconductor wafer mounted on the first surface; and a plurality of solder balls disposed on the second surface; the second surface has a first region and a second region disposed inside the first region and at the center of the second surface; the plurality of solder balls are disposed in the first region, and an insulating protrusion is disposed in the second region; the protrusion is lower than the height of the plurality of solder balls and protrudes in a direction from the first surface toward the second surface; the protrusion has a first inclined surface whose height decreases towards the first region.

Images