Semiconductor device and semiconductor package

Abstract

A semiconductor device and a semiconductor package are disclosed. The semiconductor device includes a substrate and an interconnection layer. The substrate includes a device region and a peripheral region adjacent to the device region. The interconnection layer is disposed on the substrate and includes a circuit structure and a first structure, the circuit structure is overlapped with the device region, and the first structure is overlapped with the peripheral region. The first structure includes a plurality of first portions and a plurality of second portions, the first portions are arranged in a first direction parallel to a normal direction of the substrate, and the second portions are disposed between two adjacent ones of the first portions and arranged in a second direction perpendicular to the first direction. In a cross-sectional view, the first structure has a first rounded corner between an inner side surface of one of the first portions and an inner side surface of one of the second portions.

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