Method for making an electronic package
TW202641387APending Publication Date: 2026-10-01JCET STATS CHIPPAC KOREA LTD
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Patent Information
- Application Number
- TW115123318
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-09-22
- Filing Date
- 2023-08-22
- Publication Date
- 2026-10-01
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Abstract
An electronic package and a method for making an electronic package are provided. The electronic package comprises a substrate; a plurality of electronic components disposed on the substrate; and an encapsulant cap for encapsulating the substrate and the plurality of electronic components, wherein the encapsulant cap comprises a top surface having a first region and a second region; and wherein the first region has a first roughness, the second region has a second roughness greater than the first roughness.
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