Semiconductor package

TW202641392APending Publication Date: 2026-10-01MEDIATEK INC
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Patent Information

Application Number
TW115101820
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2026-01-13
Filing Date
2026-01-16
Publication Date
2026-10-01

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    Figure TWG2TA001079079_002
  • Figure TWG2TA001079079_003
    Figure TWG2TA001079079_003
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Abstract

A semiconductor package is provided. The semiconductor package includes an exposed pad, at least one extension portion, a die, and a molding compound. The extension portion is connected to the exposed pad and extends on a plane of a bottom surface of the exposed pad. The die is mounted on a top surface of the exposed pad. The top surface is opposite the bottom surface. The molding compound encapsulates the die and surrounds the exposed pad and the extension portion. The bottom surface of the exposed pad and a bottom surface of the extension portion are exposed from the molding compound.
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