Evaluation of sample manufacturing methods, evaluation samples and evaluation methods

Abstract

The evaluation sample manufacturing method includes: a configuration step of configuring a first wafer on a substrate; and a first bonding step of bonding a substrate with a first adhesive film disposed on it to the substrate, such that the first wafer is embedded in the first adhesive film. The evaluation sample includes: a substrate; a first wafer disposed on the substrate; a first adhesive film in which the first wafer is embedded and attached to the substrate; and a substrate attached to the side of the first adhesive film opposite to the substrate, with its periphery warped toward the substrate side. Another evaluation sample includes: a substrate; a first wafer disposed on the substrate; an adhesive layer in which the first wafer is embedded and attached to the substrate; and a substrate attached to the side of the adhesive layer opposite to the substrate, with its periphery warped toward the substrate side.

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