Cutting machining apparatus

TW202641462APending Publication Date: 2026-10-16KANAZAWA UNIV
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115106492
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-25
Filing Date
2026-02-24
Publication Date
2026-10-16

Smart Images

  • Figure TWG2TA001081129_001
    Figure TWG2TA001081129_001
  • Figure TWG2TA001081129_002
    Figure TWG2TA001081129_002
  • Figure TWG2TA001081129_003
    Figure TWG2TA001081129_003
Patent Text Reader

Abstract

An object of the present invention is to provide a cutting machining apparatus capable of suppressing an increase in size. The cutting machining apparatus includes: a cutting device that cuts a workpiece by rotation of a tool; a holding device that holds the workpiece; a moving device that relatively moves the tool and the workpiece in an extending direction of a rotation axis of the tool; and a control device that controls the cutting device, the holding device, and the moving device to cut the workpiece along a spiral machining path. The cutting device includes: a spindle that rotationally drives the tool; and a tool swinging device that swings at least the tool around a first axis parallel to the rotation axis. The holding device includes a workpiece rotating device that is provided independently of the tool swinging device and rotates the workpiece around a second axis parallel to the first axis.
Need to check novelty before this filing date? Find Prior Art