Wafer processing methods and apparatus

Abstract

The embodiments disclosed herein provide a wafer processing method and apparatus. The wafer processing method includes rotating a wafer; spraying a first liquid onto the center of the wafer for a preset time through a first nozzle; continuing to spray the first liquid and spraying a second liquid onto the wafer surface through a second nozzle, wherein the contact point of the second liquid falls between a first position and the center of the wafer, and the centrifugal force on the second liquid at the first position is less than the force that causes the second liquid to diffuse outward from the contact point; and stopping the spraying of the first liquid onto the center of the wafer after the second liquid reaches the center of the wafer. The wafer processing method and apparatus disclosed herein can improve wafer processing yield.

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