Apparatus for forming conductive film and method for forming conductive film

TW202641638APending Publication Date: 2026-10-16SHIBAURA MECHATRONICS CORP
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Patent Information

Application Number
TW115111973
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-31
Filing Date
2026-03-27
Publication Date
2026-10-16

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Abstract

The present invention aims to provide a conductive film forming apparatus and a conductive film forming method capable of forming a uniform conductive film in through-holes of a substrate. An embodiment of the conductive film forming apparatus includes: a roller having an inner peripheral surface forming a hollow structure and a holding portion disposed on the inner peripheral surface and holding the substrate; an inkjet head for ejecting conductive ink; a rotation mechanism for rotating the roller; and a control unit for controlling the inkjet head to eject the conductive ink into a plurality of through-holes of the substrate, and, after the ejection of the conductive ink by the inkjet head is completed, controlling the rotation mechanism to rotate the roller.
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