Wafer brush cleaning device

Abstract

This invention relates to a wafer brush cleaning device, which is installed in a wafer cleaning equipment to remove deposits from the two brushes of the wafer cleaning equipment. The wafer brush cleaning device includes a positioning component that can be installed in the wafer cleaning equipment and a rectangular cleaning plate that can be assembled to the positioning component. The cleaning plate is made of quartz material with a surface roughness greater than 0.67μm. The cleaning plate is located between and in contact with the two brushes of the wafer cleaning equipment. This wafer brush cleaning device can effectively improve the brush cleaning efficiency by utilizing the material and surface roughness characteristics of the cleaning plate. At the same time, the rectangular shape can significantly reduce the waste generated during the manufacturing and cutting process, effectively avoiding resource waste.

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