Wafer cleaning brush with nodule-tip fluid delivery

TW202641642APending Publication Date: 2026-10-16TCNV LLC
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Patent Information

Application Number
TW115106244
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-09
Filing Date
2026-02-13
Publication Date
2026-10-16

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Abstract

A wafer-cleaning brush includes a hollow core configured to receive a cleaning fluid and a plurality of fluid-permeable nodules disposed on the core. Each nodule includes a dispensing outlet at a distal tip in fluid communication with the core such that the cleaning fluid is dispensed at or near a brush–wafer interface during cleaning. In embodiments, the dispensing outlet comprises a pore at the distal tip and / or a passive slit-based outlet configured to regulate discharge of the cleaning fluid. Distal tips may include surface features that guide fluid laterally across a wafer surface. A cleaning system may combine deionized water and chemistry upstream of the brush, optionally monitor dissolved oxygen, and deliver fluid to a wet module for cleaning and subsequent drying.
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