Heating apparatus and method for manufacturing solder-joined object
TW202641650APending Publication Date: 2026-10-16ORIGIN CO LTD(JP)
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Patent Information
- Application Number
- TW115103447
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-26
- Filing Date
- 2026-01-28
- Publication Date
- 2026-10-16
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Figure TWG2TA001081041_001 
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Figure TWG2TA001081041_003
Abstract
A heating apparatus includes a support member that supports an object to be heated, and a heater that heats the object supported by the support member or the support member supporting the object. The heater includes a plurality of annular heating elements. Each heating element has a different circumferential length and is arranged in a nested manner and is capable of outputting a different amount of heat and of changing the amount of heat to be output. A method for manufacturing a solder-joined object, which uses the heating apparatus, includes supplying the object to the support member, causing the heating elements to generate heat to raise the temperature of the object to a first predetermined temperature, changing an output ratio of the heating elements to maintain the first predetermined temperature, supplying a reducing gas, and increasing the outputs of the heating elements to raise the temperature to a second predetermined temperature to perform solder joining.
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