Bonding alloy layer and its bonding method

Abstract

This invention includes a preparing step, a heating step, an ultrasonic vibrating bonding step, and a mutual-dissolving step. A first base layer, a bonding alloy layer, a second base layer, and an ultrasonic vibrating bonding device are stacked sequentially on a heating plate. The bonding alloy layer contains aluminum, silver, zinc and copper or rare earth. After the bonding alloy layer is melted by heating the heating plate, the ultrasonic vibrating bonding device is activated to vibrate this bonding alloy layer. Hence, the interfaces among the first base layer, the bonding alloy layer, the second base layer are mutual-dissolved and then the bonding alloy layer will be vanished. So, the first base layer and the second base layer are well-bonded. It is convenient that the joining process of this invention can be done under a general atmospheric environment. The heating time is short. Plus, the characteristics are good after the bonding process is completed.

Claims

1. A bonding filler alloy layer for bonding a first base material layer and a second base material layer; one of the first base material layer and the second base material layer is a graphene-copper composite; the other of the first base material layer and the second base material layer is an aluminum alloy, a graphene-copper composite, or AlSiC; the bonding filler alloy layer has a thickness between 10 and 300 micrometers; wherein, The bonding filler alloy layer system contains the following components by weight percentage: 1 wt.% to 20 wt.% aluminum; 0.1 wt.% to 5 wt.% silver; and an additive selected from 0.5 wt.% to 5 wt.% copper and 0.05 wt.% to 0.15 wt.% rare earth elements; The remainder is zinc.

2. The bonding filler alloy layer as described in claim 1, wherein: Aluminum 14 wt.%; Silver 1 wt.%; and copper 1 wt.% of the additive system.

3. The bonding filler alloy layer as described in claim 1, wherein: Aluminum 14 wt.%; Silver 2 wt.%; This additive system contains 0.1 wt.% rare earth elements.

4. The bonding filler alloy layer as described in claim 3, wherein, This rare earth element is one of cerium (Ce), lanthanum (La), or yttrium (Y).

5. A method for bonding a bonding filler alloy layer, comprising the following steps in sequence: a preparation step, wherein a heating plate is provided on which a first base material layer, a bonding filler alloy layer, a second base material layer and an ultrasonic vibration device are stacked sequentially; the bonding filler alloy layer has a thickness between 10 and 300 micrometers (μm); and the bonding filler alloy layer contains the following components in weight percentage: 1 wt.% to 20 wt.% aluminum; 0.1 wt.% to 5 wt.% silver; an additive selected from 0.5 wt.% to 5 wt.% copper, 0.05 wt.% to 0.15 wt.% rare earth elements; and the remainder being zinc; the ultrasonic vibration device having an ultrasonic amplitude transformer; a heating step, wherein the heating plate is heated to 400-550 degrees Celsius, and the heating plate conducts heat to the bonding filler alloy layer through the first base material layer, causing the bonding filler alloy layer to be in a molten or semi-molten state; An ultrasonic vibration bonding step involves pressing the ultrasonic amplitude transformer against the second base material layer and performing ultrasonic vibration to assist bonding. The vibration frequency of the ultrasonic vibration is 20kHz±5kHz; the amplitude of the ultrasonic vibration is between 3 and 10 micrometers; and the vibration time can be 0.5 to 60 seconds. This allows the bonding filler alloy layer to become mutually soluble with the first base material layer and the second base material layer. A mutual soluble completion step is then performed, after which the bonding filler alloy layer disappears, and the bonding of the first base material layer and the second base material layer is completed.

6. The bonding method for the bonding filler alloy layer as described in claim 5, wherein: In the preparation step, the bonding filler alloy layer is first rolled by a rolling mill to form a thin sheet, with the thickness between 10 and 300 micrometers; in the heating step, the molten state of the bonding filler alloy layer is either a semi-molten state or a fully molten state; and the initial melting temperature of the bonding filler alloy layer is 385 degrees Celsius ± 10 degrees Celsius.

7. The bonding method for the bonding filler alloy layer as described in claim 5, wherein: Aluminum 14 wt.%; Silver 1 wt.%; and copper 1 wt.% of the additive system.

8. The bonding method for the bonding filler alloy layer as described in claim 5, wherein: Aluminum 14 wt.%; Silver 2 wt.%; This additive system contains 0.1 wt.% rare earth elements.

9. The bonding method for the bonding filler alloy layer as described in claim 8, wherein, This rare earth element is one of cerium (Ce), lanthanum (La), or yttrium (Y).

Images