Marking wheel and marking method

TW202641687APending Publication Date: 2026-10-16MITSUBOSHI DIAMOND IND CO LTD
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Patent Information

Application Number
TW115106984
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2026-01-23
Filing Date
2026-02-26
Publication Date
2026-10-16

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Abstract

The objective of this invention is to provide a scribing wheel and scribing method that can minimize peeling between the resin film and the brittle substrate when scribing a brittle substrate with a resin film attached, thereby forming a vertical crack in the brittle substrate. A preferred embodiment of the scribing wheel of this invention comprises: a body portion rotatable about an axis, including a peripheral end of the body portion and a pair of inclined surfaces defining the peripheral end of the body portion; a pair of shoulders, each including a peripheral end of the shoulder portion, i.e., a protrusion disposed from the body portion along the axis at a predetermined width; and a pair of grooves formed between the body portion and the pair of shoulders.
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