Semiconductor ingot cutting device and semiconductor ingot cutting method

TW202641688APending Publication Date: 2026-10-16SUMCO CORP
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Patent Information

Application Number
TW114130096
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-10
Filing Date
2025-08-07
Publication Date
2026-10-16

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Abstract

[Subject] To provide a semiconductor ingot cutting device capable of eliminating large warpage occurring at the edges of sliced ​​wafers and improving overall flatness by reducing the influence of temperature. [Solution] A semiconductor ingot cutting device is provided, which includes a main roller, a motor, a pulley, a pulley chamber, and a temperature sensor. The main roller is wound with a cutting wire. The pulley connects the main roller and the motor, and transmits rotational motion of the motor to the main roller. The pulley chamber accommodates the pulley. The temperature sensor senses temperature of the pulley.
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