Electromagnetic wave shielding materials, coating materials or outer packaging materials, and electrical and electronic machinery

TW202641701APending Publication Date: 2026-10-16JX NIPPON MINING & METALS CORP
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Patent Information

Application Number
TW114131421
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-10
Filing Date
2025-08-18
Publication Date
2026-10-16

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Abstract

This invention provides an electromagnetic wave shielding material that exhibits good deep-drawing formability even with relatively low tensile fracture strain and suppresses deformation after forming. The invention is an electromagnetic wave shielding material 100 comprising a laminate containing at least one metal layer 110 and at least one resin layer 160. The tensile fracture strain ε of the laminate is 80.0% or less, and the compressive nominal stress σ of the laminate at a compressive nominal strain of 30.0% is 190.0 MPa or less. none
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