Modified substrate and methods for manufacturing the same

TW202641704APending Publication Date: 2026-10-16ETERNAL MATERIALS CO LTD
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Patent Information

Application Number
TW114112294
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-31
Publication Date
2026-10-16

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    Figure TWG2TA001079841_003
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Abstract

The present invention provides a modified substrate, which comprises a substrate, a polyimide layer disposed on at least one of the surface of the substrate, and a patterned conductive material, wherein the patterned conductive material is disposed on the polyimide layer. The polyimide layer improves the adhesion of the conductive material to the substrate. The present invention also provides a method of producing a modified substrate, which comprises heating the substrate at a temperature of about
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