Wafer transfer blade and assembly

Abstract

Among other things, a wafer transfer blade is provided. The wafer transfer blade has a bottom exterior and a top exterior opposite the bottom exterior. The bottom exterior has a support configuration disposed between a front structure and a rear structure that extend above the support configuration. The support configuration has a front portion adjoining the front structure and a rear portion adjoining the rear structure. The rear portion has a slide having a top surface that extends downwardly from a front joint located toward the front structure to a rear joint located toward the rear structure.

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