Silicon dioxide particles, silicon dioxide sol, methods for manufacturing silicon dioxide particles, polishing compositions, polishing methods, methods for manufacturing semiconductor wafers, and methods for manufacturing semiconductor devices.

Abstract

The object of this invention is to provide silica particles, silica sol, and abrasive compositions that are less likely to cause defects in the workpiece being polished. This invention relates to silica particles that, when the mass ratio of alkoxy groups within the silica particles is set as x (mass %) and the mass ratio of silanol groups within the silica particles is set as y (mass %), satisfy the following formula (1): y (mass %) < 8x (mass %) + 0.5 ・・・ (1).