Resin compositions, prepregs, resin films, multilayer boards, printed circuit boards, and semiconductor packages

Abstract

A resin composition is provided that exhibits excellent flame retardancy and reduces the minimum melt viscosity of a prepreg. Furthermore, prepregs, resin films, multilayer boards, printed circuit boards, and semiconductor packages made using this resin composition are provided. Specifically, the aforementioned resin composition is a resin composition containing (A) a thermosetting resin, (X) a metal phosphate salt, and (Y) a phosphazene compound. none