Light-curable resin compositions and molded articles comprising them, as well as electrical components.

Abstract

The objective of this invention is to provide a photocurable resin composition for obtaining molded articles that possess high strength, low thermal expansion coefficient, and wear resistance. The photocurable resin composition that solves this objective comprises (A) a multifunctional acrylic resin and (B) silica particles, wherein the (A) multifunctional acrylic resin comprises (A1) a polycyclic aliphatic acrylic resin and (A2) an isocyanuric acid type acrylic resin. In this photocurable resin composition, the amount of (A1) component relative to the total amount of (A) component is 20% by mass or more and 80% by mass or less, the amount of (A2) component relative to the total amount of (A) component is 20% by mass or more and 80% by mass or less, and the amount of (B) silica particles relative to the total amount of the photocurable resin composition is 20% by mass or more and 40% by mass or less. (B) The average primary particle diameter of the silicon dioxide particles is less than 100 nm, and the aggregated particle diameter of the (B) silicon dioxide particles, as determined by a specific method, is more than 3 μm and less than 50 μm.