Photosensitive resin composition, cured material and substrate

Abstract

[Problem] To provide a photosensitive resin composition that maintains good defoaming properties and good hardening resolution even when the coating film is thickened. [Solution] A photosensitive resin composition comprising: a photosensitive resin, a thermosetting resin, a photopolymerization initiator, a filler, a defoamer, and a solvent; wherein, relative to the total amount of solvent contained in the aforementioned photosensitive resin composition, the content of solvents with a boiling point of 200-250°C at atmospheric pressure is 55% by mass or more; and the surface tension of the aforementioned photosensitive resin composition is 30-36 mN / m.