Resin composition and hardened film

TW202641917APending Publication Date: 2026-10-16SUMITOMO CHEM CO LTD
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Patent Information

Application Number
TW115110323
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-25
Filing Date
2026-03-19
Publication Date
2026-10-16
Patent Text Reader

Abstract

The purpose of this invention is to provide a resin composition capable of forming a low-elasticity hardened film. This invention is a resin composition comprising epoxy resin, alumina particles, and flux, wherein the difference between the Hansen solubility parameter of the alumina particles and the Hansen solubility parameter of the flux is 10.0 (J / cm³) to 0.5 or less. Preferably, the alumina particles have a volumetric D50 of 3.0 μm or less in their cumulative particle size distribution, and the alumina particles have an alpha radiation content of 0.006 cph / cm² or less.
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