Resin composition and hardened film
TW202641917APending Publication Date: 2026-10-16SUMITOMO CHEM CO LTD
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Patent Information
- Application Number
- TW115110323
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-25
- Filing Date
- 2026-03-19
- Publication Date
- 2026-10-16
Abstract
The purpose of this invention is to provide a resin composition capable of forming a low-elasticity hardened film. This invention is a resin composition comprising epoxy resin, alumina particles, and flux, wherein the difference between the Hansen solubility parameter of the alumina particles and the Hansen solubility parameter of the flux is 10.0 (J / cm³) to 0.5 or less. Preferably, the alumina particles have a volumetric D50 of 3.0 μm or less in their cumulative particle size distribution, and the alumina particles have an alpha radiation content of 0.006 cph / cm² or less.
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