Organopolysiloxane composition, low dielectric constant polymer film, semiconductor device, optical element and optoelectrical device comprising the same, and methods using the same

TW202641925APending Publication Date: 2026-10-16PIBOND OY
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Patent Information

Application Number
TW114148220
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-30
Filing Date
2025-12-09
Publication Date
2026-10-16

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Abstract

The present invention relates to low dielectric constant films comprising polymerized organopolysiloxane material obtained by polymerization of organo functionalized monomers. The invention also concerns a method of forming such films by applying organopolysiloxane material containing compositions on a substrate in the form of a layer and by curing the layer to form a film. Further, the invention concerns uses of the low dielectric constant films of the invention in semiconductor devices, optical elements and optoelectronic devices.
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