Addition-curing silicon oxide compositions, their cured forms, and optoelectronic semiconductor devices

Abstract

An addition-curing silica composition comprising: (A) (i) the compound represented by (1) below, and (ii) the branched organopolysiloxane resin (ii-a) or a mixture comprising (ii-a) represented by (2) below, having an alkenyl group bonded to silicon atoms; (B) an organohydrogen polysiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule and not containing a cyclic silica structure; and (C) a platinum group metal catalyst. This provides an addition-curing silica composition that yields a cured product with less reduction in heat and light transmittance. none