Semiconductor film adhesives and their manufacturing methods, adhesive tapes and their manufacturing methods, semiconductor devices and their manufacturing methods, and methods for manufacturing coating solutions.
TW202641942APending Publication Date: 2026-10-16RESONAC CORP
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Patent Information
- Application Number
- TW114149731
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-20
- Filing Date
- 2025-12-17
- Publication Date
- 2026-10-16
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Abstract
This invention discloses a film-like adhesive for semiconductors, comprising a thermosetting resin, a thermoplastic resin, a thermally conductive filler, and a dispersant with a polar group. Based on the total amount of the semiconductor film-like adhesive, the content of the thermally conductive filler is 50% by mass or more.
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