Adhesive composition and adhesive body
TW202641945APending Publication Date: 2026-10-16RESONAC CORP
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Patent Information
- Application Number
- TW115101654
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-17
- Filing Date
- 2026-01-15
- Publication Date
- 2026-10-16
Abstract
This invention discloses an adhesive composition containing a (meth)acrylate compound, an epoxy compound, and a photoinitiator. When this adhesive composition is shaped into a shape with a length of 20 mm × width of 20 mm × thickness of 500 μm and cured by irradiation with ultraviolet light, the resulting cured product has a transmittance of more than 70% for infrared light with a wavelength of 1310 nm.
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