Thermally conductive paste
TW202641946APending Publication Date: 2026-10-16SUMITOMO BAKELITE CO LTD
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Patent Information
- Application Number
- TW114144229
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-26
- Filing Date
- 2025-11-13
- Publication Date
- 2026-10-16
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Abstract
A thermally conductive paste containing a polymeric compound and metal particles, wherein the viscosity η5 of the aforementioned thermally conductive paste, measured using a type B viscometer at 5 rpm at 25°C, is 8 Pa·s or more and 30 Pa·s or less. The polymeric compound contains an epoxy-containing acrylic resin, the molecular weight of the epoxy-containing acrylic resin is 10,000 or more, and the content of the epoxy-containing acrylic resin relative to 100 parts by weight of the thermally conductive paste is 0.1 parts by weight or more and 5 parts by weight or less. none
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