Silicon carbonitride polishing composition and method
TW202641947APending Publication Date: 2026-10-16CMC MATERIALS INC
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Patent Information
- Application Number
- TW114151717
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2021-02-04
- Filing Date
- 2022-02-07
- Publication Date
- 2026-10-16
Abstract
A chemical mechanical polishing composition for polishing a substrate including a silicon carbonitride layer, the composition comprising, consisting essentially of, or consisting of a water based liquid carrier, anionic colloidal silica particles dispersed in the liquid carrier, a topography control agent, and having a pH in a range from about
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