Solder alloys, solder balls and solder joints

Abstract

The present invention employs a lead-free and antimony-free solder alloy having an alloy composition comprising Ag: 1.0 to 4.0 wt%, Cu: 0.1 to 1.0 wt%, Bi: 0.1 to 9.0 wt%, Ni: 0.005 to 0.3 wt%, Ge: 0.001 to 0.015 wt%, and the remainder being Sn. Provided is a lead-free and antimony-free solder alloy having an alloy composition of Ag: 1.0 to 4.0% by mass, Cu: 0.1 to 1.0% by mass, Bi: 0.1 to 9.0% by mass, Ni: 0.005 to 0.3 % by mass, Ge: 0.001 to 0.015% by mass, and the balance of Sn.